Steve Liang obtained his Ph.D. in Chemical Engineering and Materials Science from University of California, Irvine, and Master in Materials Science and Engineering from Xian Jiaotong University. The post doctoral research project he worked on low pressure plasma reactive synthesis of Mo2Si composite at Germany Schott Glaswerke R & D center received the 1995 Journal of Thermal Spray Technology Best Award. He has held senior engineering and management positions in major institutions and international companies, including Beijing National Research Institute for Non-Ferrous Metals; Ceradyne Inc. of Costa Mesa, California; Valor Electronics, Inc. of San Diego, California; Rockwell Semiconductor / Conexant Systems Inc. of Irvine, California; Alpha Industries Inc. of Woburn, Massachusetts; and Skyworks Solution Inc. of Woburn, Massachusetts. He was the Senior Manager of IC Package Development in Alpha Industries Inc. and the Senior Principle Engineer of RF Package Development in Skyworks Solution Inc., with rich and deep experiences on RFIC, MEMS and communication semiconductor advanced packaging technology development and management. He was also holding the positions of Technology Vice President and General Manager in Laminate Packaging Business Division, Jiangsu Changjiang Electronics Technology Co., Ltd. With more than 10 worldwide patents and 20 publications in books, journals and international conferences, Steve Liang has been a pioneer in the development and commercialization of advanced MCM-L RFIC SiP package based on high density high performance laminate substrates and fine pitch components.
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