The fast changing and advancing scaling technique and potential device infrastructure
David Xiao
Shanghai Integrated Circuit Research and Develop (ICRD) Center
Symposium II: Lithography and Patterning
Symposium II: Lithography and Patterning
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Leo Pang
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3D NAND Technology Cost Scaling Challenges and Solutions
Richard Yang
Fortune Precision Corp, Shenyang
Role of underlayers in novel patterning for EUV lithography
Douglas Guerrero
Brewer Science, Inc.
Considerations in seting up industry standards for photolithography process, historical perspectives, methologies, and outlook
Qiang Wu
Fudan University
The status of stochastic issues - Photon stochastic and Chemical Stochastic -
TORU FUJIMORI
FUJIFILM Corporation
Advanced Lithography Material Status toward 5nm Node and beyond
Koichi FUJIWARA
JSR Shanghai Co., Ltd.
Thickness Dependence of Properties of EUV Underlayer Thin Films
Jae Hwan Sim
DuPont Electronics and Industrial
Process window, and process optimization in both Low and High NA EUV lithography for advanced logic technologies nodes
Yanli Li
Fudan University
Critical pattern selection for full chip SMO application
Sikun Li
Shanghai Institute of Optics and Fine Mechanics
Machine Learning Post Lithography Resist 3D Structure Model For Full Chip Implementation
Xuelong Shi
Shanghai IC R&D Center
Inverse lithography technology: 30 years from concept to practical, full-chip reality
Leo Pang
D2S, Inc.
Gan-based fast mask near-field calculation
Yijiang Shen
Guangdong University of Technology
Model-driven Deep Learning for Computational Lithography
Xu Ma
Beijing Institute of Technology
A Study of Improved Design Rules through Allowing 4degree Metal Lines
Xianhe Liu
Fudan University, School of Microelectronics
High Power LPP-EUV Source for Semiconductor HVM Lithography and Other Application
Hakaru Mizoguchi
Gigaphoton
Nanoimprint Performance Improvements for High Volume Semiconductor Manufacturing Keita Sakai
Keita Sakai
Canon Inc.
EPE and CD performance enhancement by "GT66A", the next-generation immersion ArF lightsource
Takamitsu Komaki
Gigaphoton
KrF Multi-Focal Imaging system for advanced and legacy applications
Will Conley
ASML
Critical dimension metrology: from OCD to XCD
Xiuguo Chen
Huazhong University of Science and Technology
A new generation cost-efficient laser mask writer, addressable up to the 90nm node
Youngjin Park
Mycronic Co., Ltd.
EUV vacuum system safety while maximizing process productivity
Zhen Ma
Edwards
DOSE CONTROL STRATEGY USING RANDOM LOGIC DEVICE PATTERNS AND MASSIVE METROLOGY IN A FOUNDRY HIGH VOLUME MANUFACTURING ENVIRONMENT (PPT)
Kan Zhou
HLMC
Patterning capability of surface plasmon imaging
Lihong Liu
Institute of Microelectronics, Chinese Academy of Sciences
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Utilizing Bossung Plot to calibrate OPC optical model
Jian Wang
Semiconductor Manufacturing International Corporation
CD-SEM contour extraction for complex features measurement
Ting He
Semiconductor Manufacturing International (Shanghai) Corporation
New model-rules-hybrid sbar placement strategy for 2D pattern
Ge Zhang
Semiconductor Manufacturing International Corporation
Process Window Integration Rule Check for BEOL in Advanced Tech Node
Xiaoyan Wang
Semiconductor Manufacturing International Corporation(SMIC)
Effect of high energy implantation on the photoresist for smaller size CMOS image sensor
Chen Hui
HLMC
Stitching Process Development on 300mm Wafer CMOS BEOL for High Performance Chip Application
Xiaoxu Kang
Shanghai ICR&D Center
Novel optical storage scheme with three recording dimensions enables a high density storage
Dekun Yang
Wuhan University
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