Cutting-edge epitaxial processes of group IV materials for advanced technology nodes
Andriy Hikavyy
Imec
Symposium IV: Thin Film, Plating and Process Integration
Symposium IV: Thin Film, Plating and Process Integration
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Beichao Zhang
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Advanced Transisitor Structure Exploration by DTCO method
Shaofeng Yu
Fudan University
Increasing the Post Halo Implantation Anneal Temperature for the Effective Improvement of Threshold Voltage Roll-off Induced by the Unique Non-uniform Boron Diffusion from the Embedded Source/Drain
Runling Li
Fudan University
Investigation of the baking process on the substrate interface and the epitaxial growth
Zhenya Xu
Shanghai IC R&D Center
INVESTIGATION OF NANOSHEET DEFORMATION DURING CHANNEL-RELEASE IN GATE-ALL-AROUND NANOSHEET TRANSISTORS
Jingwen Yang
Fudan University
Pinch off Ultrathin Film Plasma CVD Deposition Process and Material Technology for Nano-device Air Gap/Spacer Formation
Nguyen Son
IBM
The application of Lau’s Schottky-Poole-Frenkel theory to distinguish leakage current mechanisms in high-k MIM capacitors by pattern recognition
Wai Shing Lau
Nanyang Technological University
Minimizing residual stress of aluminum nitride (AlN) thin films using multi-step deposition of DC pulsed sputtering
Wei-Lun Chen
National Central University
Dielectric CVD to address Challenges for Logic, Memory and Packaging Integration
David Chu
Applied Materials
SILICON PHOSPHORUS PROCESS UNIFORMITY IMPROVEMENT STUDY IN ADVANCED NODE (PPT)
Huojin Tu
HLMC
The study of SiGe channel formation for FDSOI (PPT)
Lan Jiang
HLMC
Novel Barrier and Integration Flow for Low Resistance Interconnects
Lee Brogan
Lam Research
Low-temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion
Shuchao Bao
School of Electronic Science and Engineering, Xiamen University
Proliferation of ALD technology in the nano device era
Jerry Chen
ASM
ALD applications in advanced nodes (Language: In Chinese)
Weiming Li
Jiangsu Leadmicro Nano-Equipment Technology Ltd.
Achieving 100% Gap-Fill for Deep Trenches through Fundamental Understanding of SiO2 PEALD Mechanism
Toshihisa Nozawa
Piotech Inc.
The effect of interfacial and bulk free energies on the leakage current vs voltage characteristics of high-k MIM capacitors prepared by atomic layer deposition
Wai Shing Lau
Nanyang Technological University
Enhanced Fill of Tungsten in 3D NAND Wordline: A View of Molecular Diffusion
Xin Gan
Lam Research
2D material and applications
Zhihong Chen
Purdue University
A Hybrid Modelling Approach for the Digital Twin of Device Fabrication
Dong Ni
Zhejiang University
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Effects of coil surface current density on plasma characteristics in a PECVD chamber
Jiangjie Zeng
Jiangsu Normal University
Metal Gate inline Vt Variation Improvement for Advanced Technology
Canyang Xu
Applied Materials
Aluminum Gap Fill Improvement For 28 HKMG Process
Shihao Wang
HLMC
AMAT High Throughput HDPCVD Ultima XT Introduction
Tengfei Zhang
Applied Materials
Research on the oxidation behavior of Titanium nitride thin films and Resistance simulation
Xiaotong Zhang
HLMC
Improvement of Aluminum Diffusion In HKMG Process
Xiaoyang Xi
HLMC
ALUMINUM NITRIDE BASED ETCH STOP LAYER TO ELIMINATE ILD OVER-ETCH ISSUES IN LOGIC BEOL VIA PATTERNING
Jiang Yu
Lam Research
INVESTIGATION OF 14 NM CONTACT TUNGSTEN GAP-FILLING PERFORMANCE
Xiaofang Wang
HLMC
Improve SADP/SAQP ALD SIN spacer uniformity by patterned dummy
Xin Xu
Shanghai IC R&D Center
Decoupled-plasma Oxidation Process to Improve ALD Oxide Film Quality as IO Device Gate Oxide
Xin Xu
Shanghai IC R&D Center
Influence of Material Manufacturing Method on the Growth of Aluminum Fluoride on Heater surface in Plasma Enhanced Chemical Vapor Deposition
Xiaochen Wang
Piotech Inc.
The influence of O3/TEOS and He/TEOS flow ratio on gap filling of shallow trench isolation filled with silicon oxide in sub-atmospheric chemical vapor deposition
Zhenjie Liu
Piotech Inc.
Impact of SiOx Underlayer on PECVD Amorphous Silicon Film Edge Peeling Defect
Cherry Xu
Lam Research
Effects of stacked Al2O3 / HfO2 films deposited in Deep Trench Isolation on White Pixels Noise
Qixin Wu
Semiconductor Manufacturing International Corporation(SMIC)
Uniformity optimization and defect reduction of Precision TEOS process
Junmei Li
Applied Materials
Thick Epi Process Development on CENTURA ATM Epi System
Xingxing Liu
Applied Materials
Applied Materials® Impulse PVD SiN for DRAM Bitline Rs Reduction
Jiachuan Wu
Applied Materials
EPI JIT function balance wafer process parameter
Junyi Hu
Applied Materials
HARP Liner Penetration in Planar NAND Production
Songtao Lv
Applied Materials
Property and profile fine tune in an ICEFill tungsten deposition process
Kevin Tian
Lam Research
LHPC Contribution to Oxide Thickness
Yuning Song
Applied Materials
Advanced carbon hardmask for 3D NAND: challenges and solutions
Pengyi Zhang
Lam research
Adaptive Preheat Application on RPO Process
Zhipeng Luo
Applied Materials
FILM PROPERTY ANALYSIS BY FTIR ON ULK FILM DEPOSITION AND UV CURING PROCESS
Xinchen Cai
Piotech Technology Co., LTD.
Inhibition-Control-Enhancement Fill (ICEFill™) Dielectric PEALD for HAR Structure Gap Fill
Xin Liu
Lam Research
Analysis of Influence to Gate stack of EEPROM Using Cl doped Re-Oxidation
Hong Zhang
Fudan University
TiSi Anneal Process Improvement in Advanced CMOS Technology
Qi Zhang
Applied Materials
Optimization of Defect and range for Thick TEOS Oxide Deposition in 3D NAND Application
Chujia Huang
Applied Materials (China), Inc.
The effect of STI divot on planner logic device performance study
Zhenchao Sui
Semiconductor Manufacturing North China (Beijing) Corporation(SMNC)
Solution and Mechanism for Producer GT TEOS WER Mismatch
Aoju Li
Applied Materials
Solution for Solving the Silane Chamber RPS Path Powder
Haipeng Chen
Applied Materials
Dynamic Planarity Control for Auto and Independent Hot Leveling
Haipeng Chen
Applied Materials
300mm Wafer Laser Anneal Process Development for Applications of Multiple Process Condition in Different Zones on Single Wafer
Zhenghui Chu
Shanghai ICR&D Center
Conformal Si STI Liner Epitaxy for Advanced DRAM
Shiming Liu
Applied Materials
Void Free Process Development for Node Contact Gap Fill in DRAM
Guangyao Shen
Applied Materials
I/O ALD Gate-Ox with Plasma Treatment in Advanced Node
Gengwu Ji
Applied Materials China
Post Deposition Purge Optimization for PECVD Process Robustness in Advanced Node
Chunyuan Zhou
Lam Research
A Strategy of Eliminating Salicide Block Film Bubbles
Chao Bao
HHGrace
An Achievement of Low Resistance Non-salicide CT on Active Area
Bingquan Wang
SMIC
TaN Based Metal-Insulator-Metal Capacitor with Excellent Long-term Reliability
Linlin Zhang
HHgrace
A Strategy of Eliminating Silicon Dislocation in 55nm Node Technology
Chao Bao
HHGrace
12-inch 90-nm BCD Process Optimization Reducing Wafer Edge LDMOS Leakage
Guangyuan Lu
Hhgrace
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