Closing the Loop: CMP Process Control Methodology and Implementation
Brian Brown
Applied Materials
Symposium V: CMP and Post-Polish Cleaning
Symposium V: CMP and Post-Polish Cleaning
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Xinping Qu
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What CMP can do for Waferbonding?
Knut Gottfried
Fraunhofer-Institute for Elektronic Nanosystems ENAS
Characterization of Ceria and Silica Particle Loading on Post CMP Cleaning
Jin Goo Park
Hanyang University
Development of Post CMP Cleaning Chemistry
Cass Shang
GrandiT Co. Ltd(中巨芯)
Challenges and Solutions for Post-CMP Cleaning at Device and Interconnect Levels
Jihoon Seo
Clarkson University, Department of Chemical and Biomolecular Engineering
Nano-ceria particles cleaning by HNO3-H2O2-DIW solution at room temperature
Yingjie Wang
Fudan University
Development of CMP Head-to-Head Compensation Function for Gate Height Uniformity Control (PPT)
Yurong Que
HLMC
Several Strategies for Al Metal Gate Chemical Mechanical Planarization Scratch Reduction (PPT)
Qingxuan Hong
HLMC
Mark Damage Phenomenon Caused by Superimposed CMP Dishing on Large-Area STI Regions (PPT)
WenSheng Xu
HLMC
Chemical Mechanical Planarization of Silicon Dioxide Film in Colloidal Silica based Alkaline Slurry
Chenwei Wang
Hebei University of Technology
Component Optimization of Sapphire Slurry based on Response Surface Methodology for Chemical Mechanical Polishing
Minghui Qu
Hebei University of Technology
Merck Tungsten slurry introduction
Chun Lu
Merck
Defect Law of Cu/Co Pattern Wafers After Using A Novel Bulk/Barrier Slurry and Cleaning Solution
Lifei Zhang
Tsinghua University
IMPROVEMENT OF CU-CMP ENDPOINT CURVES FOR DIFFERENT PATTERN DENSITY (PPT)
Yi Xian
HLMC
Effect of TAZ as inhibitor on CMP process of molybdenum
Pengfei Wu
Hebei University of Technology
Effect of OA and JFCE as Surfactants on the Stability of Copper Interconnection CMP Slurry
Yan Han
Hebei University of Technology
Effect of different complexing agents on chemical mechanical polishing of copper film
Fu Luo
Hebei University of Technology
Improvement of sensitivity of eddy current thickness sensors with ferrite core for CMP process
Chengxin Wang
Tsinghua University
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Dishing improve in Advanced Technology Nodes
Yu Yang
HLMC
An optimized method for Cu CMP dishing improvement
Lei Zhang
HLMC
Study on the correlation between CMP Cu Loading and Edp curve
Yuanyuan Meng
HLMC
Tungsten CMP Consumable Localization study at 28nm Technology Node
Shaojia Zhu
HLMC
CMP Scratch improve in Advanced Technology Nodes
Weiran Sun
HLMC
Dielectric CMP WIW Uniformity Control by FullVision MPC
Ran Yin
Applied Materials
CleanStart Arm in CMP process for CoC reduction
Yifeng Zheng
Applied Materials
WiW iAPC Successful Application in Post CMP Range Control
Kun Zhang
Applied Materials
AMAT PreClean for Ceria CMP Defectivity and Productivity Improvement
Na Xiao
Applied Materials
RR Profile Trend Worse Issue Improved Through HPPC Function
Huijun Zhang
Applied Materials
Study on Preparation and Polishing Performance of Ceria slurry
Ye Wang
Hebei University of Technology
CMP PreClean Module for High Particle Removal efficiency clean
Pingyuan Lu
Applied Materials
Preclean Module for Nano Particle Reduction in Post CMP
Yongbin Wei
Applied Materials
Tool Uptime Improvement and CoC Reduction by HPPC Function
Shaopeng Zhang
Applied Materials
Low Pressure Rinse Improve the Defect of Cu Layers
Yunlong Wu
Applied Materials
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