Optical Overlay Metrology Trends in Advanced Nodes
Megged Efi
KLA
Symposium VI: Metrology, Reliability and Testing
Symposium VI: Metrology, Reliability and Testing
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Peilin Song
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Study on Weighted Binary Classifier with Imbalanced SEM defect Data
Hairong Lei
ASML-HMI
Advanced Modeling Techniques Expand Applications of Picosecond Laser Acoustics for RF Process Monitoring
Johnny Dai
Onto Innovation
All side optical chipping and crack inspection of dice in a die attach machine at high throughput
Norbert Ackerl
Besi Switzerland AG
Machine Learning Enhanced Optical Metrology
Dror Shafir
Nova LTD
Advanced Applications of Picosecond Ultrasonic Technology in Semiconductor Manufacturing
Cheolkyu Kim
Onto Innovation
Review of micro- and nanoprobe metrology for direct electrical measurements on-product wafers
Benny Guralnik
KLA
Advanced metrology techniques for MRAM production monitoring
Alberto Cagliani
KLA
Faster Fault Isolation with Advanced Data Analysis and Computer Vision
Franco Stellari
IBM Research
High inheritability and flexibility SmartTest8 TestMethod library on ultra-high-speed SerDes measurement
Jiaying Xiang
Advantest
Best practices of extreme using 93K FVI16 and AVI64 to test automotive power system basis chip
KAI KANG
Advantest
An Industry Example to Reduce the Test Time by Optimizing Data Extraction Method
Xiaofeng Liang
NXP semiconductor (China) Ltd.
ATE solution for high-resolution convertor
Qin Feng
Advantest
The flexible and inheritable SMT7 solution for High-Speed DDR PHY IP with IJTAG
Yichen Xiao
Advantest
TOWARDS LEAN FRONT END IC MANUFACTURING (with AMHS implants)
George W. Horn
Middlesex Industries Sa
Recent advances in statistical modelling methodology development for ReRAM applications
Ernest Wu
IBM Research
Study on Stress Migration of FCQFN Package with unbalanced arrangement of bumps
Shuanshe Chao
ZTE
Machine Learning Based Aging Critical Path Selection
Jiadong Yao
Sanechips Technology Co., Ltd.
Research on Reliability Optimization Mechanism of 28HKMG Technology
Weiwei Ma
Shanghai Huali Integrated Circuit Corporation (HLIC)
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I3C Protocol Testing of Sensor Interface on the Advantest V93000 Tester
Kaitao Liu
Advantest
Effective usage of Attenuators on Production Test
Hao Chen
Advantest
MCU+ Test Solution on V93000 SmartTest8
Tianyu Zhang
Advantest
Conditionally executed tests, branching and algorithmic binning - Getting it right
Lai-Choon Chan
Teradyne Inc
Study of Negative Charge Accumulation Mechanism and Removal Method on the Wafer Surface in Via Photo Development Process
Haihua Chen
Shanghai IC R&D Center
14 Bits current DAC testing with 16 Bits instruments
Luffy Jin
Teradyne
A Neural Network Approach to Analyze FDC Data in Semiconductor Manufacture
Wei Yu
HLMC
A Voltage Screen Model and Method for Early Failure Screening
Wen Ying
Semiconductor Manufacturing International Corporation(SMIC)
Study and Improvement on measurement accuracy of Image Based Overlay
Zhi-Feng Gan
Semiconductor Manufacturing International Corporation(SMIC)
Tiny SADP Defect Detection and Reduction for 19nm Nand Flash Technology Semiconductor Manufacturing Engineering
QiuFeng Cao
HLMC
Different Module's Process Affect to Poly Pattern Etch Stick Particle
Jiayi Fu
HLMC
Classification of Wafer Backside Images via FasterRcnn-Based Neural Network
Junjun Zhuang
HLMC
WAT Throughput Improved by Algorithm Optimization
Tong Chen
HLMC
Anomaly Detection of Semiconductor Processing Data based on DTW and LOF Algorithm
Yong Wang
HLMC
Reason Forecast with BERT on Test Result Alarm in Semiconductor Fab
Meng Xue
HLMC
The study of method to improve defect scan sensitivity post dummy poly remove in 14nm node
Xingdi Zhang
HLMC
The type and solution of inline poly residue defect for 28 HK process improvement
Min Wang
HLMC
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