Chiplet Cost Model Analysis, Opportunities and Challenges for Off-the-shelf Chiplets
Kaisheng Ma
Tsinghua University
Symposium VII: Packaging and Assembly
Symposium VII: Packaging and Assembly
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Integration Strategy on Low-Cost Chip-First Fan-Out Panel Level Packaging
Cheng-Tar Wu
Chengdu ESWIN System IC Co., Ltd.
Development and Application of Electroplating Copper Products with Low or Zero Internal Stress
Peipei Dong
Shinhao Materials LLC
Design and Fabrication of High-Q IPDs for Process Design Kits on Glass Substrate
Haozhe Ma
Xiamen University
Revent progress of laser induced TGV technology and it's applications
Daquan Yu
Xiamen University
Investigation on Yield Improvement of Fan-out Wafer-level Packaging
Kai Zhu
ZTE Corporation
Fine-pitch Cu-Sn transient-liquid-phase bonding based on reflow and pre-bonding
Yunfan Shi
Tsinghua University
Flip Chip Thermal Stress Induced ILD Crack & Failure Analysis
Suming Wang
TF-AMD
The study on warpage of epoxy molding compound
Yangyang Duan
Jiangsu HHCK Advanced Material Co. Ltd.
Application of Single Wet equipment in WLP (Language: in Chinese)
Yi Wang
KINGSEMI
State of the Art Metal Deposition System for Advanced UBM, RDL and Fan-Out Wafer Level Packaging
Clinton Goh
Applied Materials
Laser Release Material for wafer level Fan-out Applications
Guoping Zhang
Shenzhen Institute of Advanced Electronic Materials
Glass Carriers for Advanced Packaging
James Li
Corning Incorporated
Dielectric property design based on BaTi2O5 nanorods and BaTiO3 nanoparticles couple and its application in embedded capacitor
Wenzhong Zou
School of Materials and Energy, University of Electronic Science and Technology of China
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Optimization of Wafer Dicing-Saw to Reduce the Chipping Defect by using the Response Surface Methodology
Hong Zhang
Fudan University
The research on small "dead zones" packaging technology for mass production of silicon photomultiplier
Yuxiao Liu
Beijing Normal University, collage of nuclear science and technology
A SIMPLE METHOD FOR FINE VERTICAL INTERCONNECTION BY STENCIL PRINTED VIAS ON FLEXIBLE PRINTED CIRCUIT BOARD WITH LOW TEMPERATURE SINTERING NANO-SILVER PASTE
Xiang Xun
Institute of Semiconductors, Guangdong Academy of Sciences
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