How Process, Equipment, Material, Computation that work together to make up the Performance of Photolithography
Qiang Wu
Fudan University
Symposium II: Lithography and Patterning
Symposium II: Lithography and Patterning
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Novel Etch Solution with Sym3 for Logic BEOL Patterning Etch Applications
Hui Sun
Applied Materials
New Materials and New Functionalities Co-work scaling, and the Exploration of Inner Spacer Technique
David Xiao
Qianmo Micros Design LLC
Recent progress of EUV Chemically Amplified Resist with Negative-Tone Development (CAR-NTD) for improving Chemical Stochastic
Toru Fujimori
FUJIFILM Corporation
Acid Generation Efficiency Prediction by Bond Cleavage Calculation of EUV Photoacid Generators
Jayoung Koo
DuPont
High-efficient nanofocusing for nanopattern with a plasmonic BNA
Dandan Han
University of Chinese Academy of Sciences
From Tape to Mirrors: 50 Years of Progress in Photomask Technology
Chris Progler
Photronics
The Influence of Coma aberration on 193 nm immersion (193i) lithography process window
Yanli Li
Fudan University
Polyimides for Power Device Applications
Masao Tomikawa
Toray Industries Inc
Inverse lithography with adaptive mask complexity
Xiaoxuan Liu
Guangdong University of Technology
Mask Corner Rounding in OPC Modeling
Weimei Xie
National Integrated Circuit Innovation Center (NICIC)
A Study of the Via Pattern Lithography Process Window under the 7 nm Logic Design Rules with 193 nm Immersion Lithography
Jinhao Zhu
Fudan University
A Study of Flexible BEOL Design Rules Allowing Degreed Slanted Interconnection in Advanced Nodes
Xianhe Liu
Fudan University
Research on Cross-Level Interconnection of Metal Layers under 193 Immersion Lithography Conditions
Ying Li
National Integrated Circuit Innovation Center (NICIC)
A Study of the Minimum Area Rule under the 193 nm Immersion Lithography for Via and Cut Patterns
Qiang Wu
Fudan University
The Spin-on Multi-Layer Material Status for Advanced Device
Satoshi Dei
JSR Electronic Materials (Shanghai)
Enhancing High-throughput and High-precision CD-SEM Metrology Through Advanced Deep Learning-Based Image Processing
Bo Wang
Hitachi High-Tech Corporation
Correlation Between CD/LWR and Focus Level Fitting Error: A Process Quality Indicator
Tianhao Huang
Zhejiang University
The Impact of Wafer Warpage-Induced Unevenness on Alignment
Pan Liu
Zhejiang University
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