How Process, Equipment, Material, Computation that work together to make up the Performance of Photolithography
Qiang Wu
Fudan University
Symposium III: Dry & Wet Etch and Cleaning
Symposium III: Dry & Wet Etch and Cleaning
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Novel Etch Solution with Sym3 for Logic BEOL Patterning Etch Applications
Hui Sun
Applied Materials
New Materials and New Functionalities Co-work scaling, and the Exploration of Inner Spacer Technique
David Xiao
Qianmo Micros Design LLC
Study of tungsten-doped carbon hard mask etch using O2/NF3 based chemistry
Li-Tian Xu
Beijing NAURA Microelectronics Equipment Co., Ltd.
Plasma Corrosion Resistant ALD Coatings for Semiconductor Manufacturing Process Equipment
Lassi Leppilahti
Beneq
A Study on SADP Film Stack Selection for Line Roughness Improvement in Planar 1xnm NAND Flash
Yinan Ma
Semiconductor Manufacturing North China (Beijing) Corporation
A STUDY OF WAFER-LESS AUTO CLEAN EFFICIENCY PROMOTION METHOD IN DOUBLE PATTERNING DIELECTRIC HARD MASK PROCESS
Xinruo Su
Semiconductor Manufacturing North China
Challenge of boron-doped silicon hardmask etching
Xuehua Wang
Beijing NAURA Microelectronics Equipment Co., Ltd.
Precise etching technology of ultra thin Al2O3 film using BCl3 chemistry
Cheng Tian
Beijing NAURA Microelectronics Equipment Co., Ltd
New development of ICP etching for advanced patterning
Zhongwei Jiang
Beijing NAURA Microelectronics Equipment Co., Ltd.
The challenges and new developments on TSV etch applications
Guorong Li
Beijing NAURA Microelectronics Equipment Co., Ltd.
High aspect ratio carbon hardmask etch process for profile and LCDU control
Mengjiao Zhu
Beijing NAURA Microelectronics Equipment Co., Ltd.
Line edge roughness reduction in high aspect ratio carbon hardmask patterning for slit trench
Li Zeng
Beijing NAURA Microelectronics Equipment Co., Ltd.
Challenges of Inductively Coupled Plasma Applications
Hu Zhou
Advanced Micro-Fabrication Equipment Inc. China
Center to Edge Critical Dimension Uniformity Control in High Aspect Ratio Dielectric Etch
Jiayu Sun
Lam Research
Profile Control for BEOL Tri-layer Patterning Scheme
Xingxing Xu
Lam Research
Plasma etching solutions for compound semiconductors
Yali Fu
Beijing NAURA Microelectronics Equipment Co., Ltd.
The New Developments in Etching of Dielectrics
Yuanwei Lin
Beijing NAURA Microelectronics Equipment Co., Ltd.
A Study on Floating Gate Profile Control and Reliability Improvement in Planar 1xnm NAND Flash
Jun Wang
Peking University
Analysis of Key Factors in Reactive Ion Etching of SiC Gate Trench
Anton Kobelev
Suzhou STR Software Technology Co., Ltd.
Ultra low temperature high aspect ratio OX punch through etching
Hanlin Cui
Applied Materials
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Sidewall kink elimination of slanted gratings utilizing a twice-etching method
Jiuru Gao
Jiangsu Leuven Instruments Co. Ltd
Optimized AMMP for High Aspect-Ratio Bottom Contact Open Process in DRAM Applications
Rick Yang
Residue Improvement in Liner OX Open Process
Ruxun Yuan
Lam Research
A STUDY ON THE DIFFERENT APPROACHS OF DUMMY GATE WET REMOVAL APPLICATION
Tianhao Zhang
Lam Research
Mandrel/Non-Mandrel Imbalance Improvement for Self-aligned Reverse Patterning Process
Shiming Zhang
Lam Research
Improvement of Outer Hole Profile Bending in High Aspect Ratio Dielectric Hole Etching
Taojun Zhuang
Lam Research
Improved Si Grass Control during Profile tuning for Silicon Trench Etch in Power MOSFET
Xi Chen
Lam Research
Profile Controlling in High Aspect Ratio Si Trench Etching by Steady-State-Process
Yaming Liu
Lam Research
Ultra-Deep via Etching of Silicon Oxide for High-Voltage Capacitive Isolators
Yuyan Xia
Zhejiang University
Optimization of the Polysilicon Gate Etching Process in SONOS Memory Fabrication
Wanli Yang
Zhejiang University
Defect Improvement in Process Containing SiOx Passivation
JunMing Wang
Lam Research
Improvement of Line Roughness of Fin by Conventional Thermal Oxidation and Atomic Level Low-Temperature Ozone Treatments
Peng Wang
Integrated Circuit Advanced Process R&D Center Institute of Microelectronics of the Chinese Academy of Sciences
Reaction temperature impact on Siconi® process
Songtao Lv
applied materials
MTBC Enhancement through new WET Clean implement for preventing wafer breakage
Chunlong Qiu
Applied Materials
A low-cost solution for Selectra™ Si Chamber Etch rate drift
Jing Cao
Applied Materials
TiN Hard Mask Open Comprehensive Study
Shuda Xu
Applied Materials
Improvement of CIS TM Profile by Adjusting Gas Ratio
Ziyue Xuan
Applied Materials
Al BEoL Via Etching Challenge and Solution on Producer-GT™
Sichao Zeng
Applied Materials
Producer-GT™ High Productivity CCP Etch Solution
Xipeng Tong
Applied Materials
Application of Hardware and Process Fine Tune for Chamber Matching in DRAM Critical Etch
Nick Fang
Lam Research
Buried-Worldline Omega-Shape Profile Control and Impact in DRAM
Liubo Ma
Lam Research
HAR HMO tilting offline monitor and chamber to chamber matching solution
Kai Hu
Applied Materials
Methods of Profile Control in HVCAP VIA Etching
Tongyao Zhao
Applied Materials
Profile Control of CIS BVia Silicon Etch
Le Jiang
Applied Materials
Advanced Mixed Mode Pulsing in DRAM Active Area Etch
Zheng Ruan
Lam Research
A Study of Al etch process defects
Jiajie Li
Applied Materials
Advanced Pulsing in LELE Application for Controllable Profile
Hui Xu
Lam Research
300mm AL(0.5%Cu+1%Si) Etch Challenge and Solution on Advantage Edge Metal™
Jianjun Liao
Applied Materials
TiN selectivity improvement for All-in-one Etch
Yifeng Xu
Applied Materials
BCD process contact-etch challenges and solutions at Producer GT
Gang Sheng
Applied Materials
Study of A-Si as Dry Etch Hard Mask in BEOL Low-k Dielectric Patterning
Juxin Yin
Zhejiang University
Study on Integrated Trench Etching for Trench-Type Power MOSFET
Jingru Shen
Zhejiang University
An approach to achieve a flat bottom in Si trench with oxide & poly pillar
Wei Gu
Applied Materials
Approaches of Pitch Walking Improvement in SAQP Patterning
Rishuai Zheng
Applied Materials
A Method of VIA Etch CD Range Improvement
Qunfeng Wen
Applied Materials
Effect of Low Damage Strip on Si and SiGe Surface State
Shijing Wang
Shanghai AnBang Semi Equipment Co., Ltd
Oxide Remain Control for BCD ONO Spacer Etch on AMAT Producer GT_Wang Miao_Etch
Miao Wang
Applied Materials
Excellent Profile Control for Micro-OLED Anode Etch
Lijun Shan
Applied Materials