Jitter reduction for multi-GHz ATE up to 20 GHz
Dave Keezer
Eastern Institute for Advanced Study (EIAS) in Ningbo, China
Symposium VI: Metrology, Reliability and Testing
Symposium VI: Metrology, Reliability and Testing
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Assessing the Power-Awareness of VLSI Testing
Xiaoqing Wen
Kyushu Institute of Technology, Japan
An Efficient Library for Protocol Test on V93000
Peifeng Ni
Advantest (China) Co., Ltd
Address the challenges of mass production testing for 5G millimeter devices
Daniel Sun
Advantest (China) Co., Ltd.
Highly multi-sites front end test solution design and implementation for automotive testing
Kaitao Liu
Advantest (China) Co., Ltd
Mirroring ATPG Technology for Multi-Core Chips
Jitong Zhou
Sanechips Technology
Deep Reinforcement Learning-Based Automatic Test Pattern Generation
Wenxing Li
Institute of Computing Technology, Chinese Academy of Sciences
Doping level detection in Si or SiGe via In-Line Raman Spectroscopy
Ilya Osherov
Nova Ltd
Investigation on the root cause of ESD failure of large size WBBGA package chip
Yunhe Zhang
Sanechips Technology Co., Ltd.
The Influence of Pin Position on CDM Peak Current of Chips Based on Large-Sized CoWos Package
Liyi He
Sanechips Technology Co., Ltd.
Depth-profile Analysis of AlAsGa film via Grazing Incident X-ray fluorescence
Xujun Li
Shenzhen Angstrom Excellence Semiconductor Technology Co. Ltd
Polymorphic circuits design and applications in security
Gang Qu
University of Maryland, USA
Breakthrough the test challenges for the latest Beidou navigation and satellite communications chips
Xi Liu
Advantest (China) Co., Ltd.
Advanced Digital Baseband Signal Generation and Processing Solution for V93000 5G Small Cell Transceiver Testing
Bank Liu
Advantest (China) Co., Ltd.
Various Driver test Summary on V93000 in Automotive Device
Yang Lin
Advantest (China) Co., Ltd.
A new fast XRD apparatus for the epitaxial films with a focusing X-ray Beam
Yankun Sun
Shenzhen Angstrom Excellence Semiconductor Technology Co., Ltd
An Efficient Protocol ATE Solution for Driver IC on Advantest T6391
Xiang Cai
Advantest (China) Co., Ltd
MI's solutions for next era
Byoung-Ho Lee
Hitachi High-Tech Corporation
Metryx solution for dishing defect in Ultra thick metal ECP process
Joey Hu
Lam Research
Assessing Brittleness of Substrates and Thin Layers with Nanoindentation
Zhiming Zhang
KLA Instruments Group
Advantages of Picosecond Laser Acoustics to Process Control of Semiconductor Power Devices
Johnny Dai
Onto Innovation
Multi-physics Simulation of Electromigration in Cu Interconnect
Xuefeng Zhang
Beijing NAURA Microelectronics Equipment Co., Ltd.
Analysis and Protection Solution for Aging DC-stress Induced Waveform Distortion Issues
Haiyong Wang
Sanechips Technology Co., Ltd
Modern X/Y metrology system addressable to mature semiconductor nodes
Xueying Hai
Mycronic AB
Signal and Power Reliability for Integrated Chips and Chiplets
Lei He
UCLA, USA
Electro Optical Time Domain Reflectometry for Advanced Package Failure Analysis
Longhai Liu
Advantest (China) Co., Ltd
Test solution to prevent Dynamic Voltage Stress burning issue on ATE
Haijing Wu
Advantest (China) Co., Ltd
Reliability challenges in SiC components – performing dynamic test methodologies like DGS for meaningful measurement results
Sandro Strasser
SET GmbH, NI
Study on Failure Mechanism of C4 Bump Solder Excursion in CoWoS Package
Xixiong Wei
Sanechips Technology CO., Ltd
Scaling of Memory Performance and Capacity with Memory Processor
Fei Wang
Shandong University
Novel Process Control Solutions for Advanced Power and Automotive Semiconductor Devices
Terry Chen
Applied Materials
A Dynamic Reusable Structure of I/O Pads for Scan Chains
Qi Cheng
Sanechips Technology
V93000 test solutions introduction for Audio PA device
Junlin Wang
Advantest (China) Co., Ltd
A Closed-loop Chip Fast Binning Technology
Jiawei Wang
Sanechips Technology
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Testing implementation and challenges of processor with power path switching feature
Liuhao Chen
Advantest
A fast measurement scheme for high-speed loopback pin continuity testing
Liuhao Chen
Advantest
A Universal DPAT GUI Solution for Production Test
Hao Chen
Advantest
Picosecond Ultrasonics Applications on Electroplated Cu Process
Hua-Yuan Li
Onto Innovation
A common framework solution for firmware test on V93000 ATE platform
Yanyan Chang
Advantest (China) Co., Ltd.
Study of Coating Effect on TEM Sample Damage and Elemental Analysis
Yun Xu
SMIC
A Universal Auto Configured Efuse Solution on ADVANTEST V93000 ATE Platform
Yefang Wang
ADVANTEST
Influence of Foup Environment On Defects in Semiconductor manufacturing
Weiwei Zhao
Shanghai Huali Integrated Circuit Corporation
Streamlining Chip Testing with Simplified Digital Data Acquisition
Felix Chen
Advantest
Comparison of simulation and test results of multi-type ring oscillators on advanced process nodes
Kuili Chen
Sanechips Technology
Optimization and Validation of Sampling and TD-GCMS Analysis for Volatile Organic Compounds from Semiconductor Cleaning Coupons
Ling Wang
Ferrotec Technology Development (Shanghai) Co. Ltd
New Generation Test Framework Solution for Complicated Multi-Die Chip on ATE
Kai Zhou
Alibaba-Thead
Characterization of Ultrathin Films in HKMG by Spectroscopic Ellipsometer
Yufan Zhang
Shenzhen Angstrom Excellence Semiconductor Technology Co. Ltd
Study on STEM EDS for GeSi Atomic Layer Interface Identified and Concentration Quantified
Fan Zhang
SMIC
Quantitative analysis of the damage degree of the single-crystal silicon induced by ion implantation using an optical approach
Emma Wu
SiEn (Qingdao) Semiconductor corporation Co.,Ltd
Detecting the B concentration in the SiGeB epilayers utilizing a hybrid approach combining HR-XRD and XPS
Emma Wu
SiEn (Qingdao) Semiconductor corporation Co.,Ltd
A new multi-mode X-ray fluorescence apparatus for both blanket and pattern wafer film metrology
Yuxiang Huang
Shenzhen Angstrom Excellence Technology Co. Ltd
The Influence of Metal Barrier Punch Through Process on Dielectric Reliability at 55nm CMOS node
Chenxiao Xu
Zhejiang ICsprout Semiconductor Co., Ltd
Tunability Demonstration of RadiancePlus® on Spike Anneal Process
Xiaolong Wang
Applied Materials
Sample Preparation Method for In-Situ Tem Analysis in Integrated Circuits
Guoyang Ye
Semiconductor Manufacturing International (Shanghai) Corporation Failure Analysis Laboratory