From "Iso-Dense" Biasing to "Inverse Lithography:" Milestones in Optical Proximity Correction Technology
Michael Rieger
Synopsys (retired)
Symposium II: Lithography and Patterning
Symposium II: Lithography and Patterning
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Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
Allen Chang
JSR
The Integration and Process Challenges and Solutions for Advanced Technology Nodes
David Xiao
Qianmo Microelectronics
Advanced logic design rule optimization with complete physical model in lithographic simulation in DUV and EUV
Ken Wu
Fudan University
EUV CAR-NTD for Chemical Stochastic Reduction
Hideaki Tsubaki
FUJIFILM Corporation
Different MEOL logic layouts under 3 nm CFET architecture
Yanli Li
Fudan University
Enhancing Extreme Ultraviolet Lithography Process Metrics in the Cut Layer through Source-Mask Co-Optimization
Qi Wang
Fudan University
Source-Mask Co-Optimization Study for Oblique Direction and Oblique Patterns
Ying Li
Fudan University
OPE Matching in Advanced Logic Processes
Haoyong Wang
Fudan University
Inverse lithography with curvilinear mask rule compliance
Yijiang Shen
Guangdong University of Technology
Methodology on Adaptive Iterative Step in Inverse Lithography
Fei Ai
University of Chinese Academy of Sciences
EUV lithography modeling with high efficiency and accuracy
Jamin Liu
Huazhong University of Science and Technology
Neural Litho: Real2Sim2Real Redefines the Pipeline of Computational Lithography
Guangyuan Zhao
Hongkong Chinese University
OPC Thinking：Back to Origin
Jiang Yan
Fudan University
A Novel OPC Method based on Pattern Density
Lei Wang
Shanghai Huahong Grace Semiconductor Manufacturing Corporation
Evaluation of Hotspots EPE Propagation Through Step-by-Step SEM Contour Analysis
Kan Zhou
Shanghai Huali Integrated Circuit Corp
Mask Effects in OPC Model Calibration
Weimei Xie
NICIC
The evolving laser mask writer, a cornerstone for the semicon industry
Robert Eklund
Mycronic AB
Evaluating High-Throughput Mask Systems for Mainstream Technology Applications
Martin Glimtoft
Mycronic AB
High-Resolution Patterning of Directed Self-Assembly (DSA) Lithography via Universal Orientation Control Method
Xianhe Liu
Fudan University
Photosensitive polyimide for panel-level RDL insulator
Masao Tomikawa
Toray Industries Inc
It Is about Time to Rethink and Reteach Diffraction
David H. Wei
Quantica Computing, LLC
Mask3D-Compatible Hopkins Formulation of Full-Vector Lithography Imaging
Shaopeng Guo
Huazhong University of Science and Technology
A Neural Network Model for Wafer-Scale Photoresist Thickness Prediction Using Feature-Screened Process Monitoring Data
Liejie Huang
Zhejiang University
Investigation of 193 nm Immersion Lithography Process for Cut Layer in Middle End Of Line at 5 nm Node.
Zhiwei Ren
Fudan University
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Optimizing Photoresist Coating Processes with Computational Fluid Dynamics and Taguchi Design of Experiments
Chaoyi Zheng
Zhejiang University
Symmetry and Anisotropy in Wafer Deformation: Their Effect on Alignment Signal Degradation
Jibin He
Zhejiang University
Addressing Missing Die Data in CD-SEM Analysis: A Direction-Weighted K-Nearest Neighbor Approach
Tianhao Huang
Zhejiang University
Modeling of NTD Resist Shrinkage based on Spring-mass System
Delong Yao,
EDA Center, Institute of Microelectronics, Chinese Academy of Sciences
Source Optimization Based on The Partially Coherent Imaging Model
Jinjie Li
University of Chinese Academy of Sciences
Effects of Injection Volume and Temperature on Spin Coating Uniformity: An OpenFOAM Simulation Study
Pan Liu
Zhejiang University
An Investigation into the Optimization of Photolithography Process for Silicon Nitride Devices on the fab's 12-inch Production Line
Huiyun Jiang
Zhejiang University
The Method of OPC Correction for Narrow Neck Structures in LDD Layer
Qing Li
Shanghai Huali Integrated Circuit Manufacturing Corporation
Research on Methods to Improve the Server usage Efficiency
Li Xiao
Shanghai Huali Integrated Circuit Corporation