Grinding and Chemical Mechanical Polishing Applications in Advanced Packaging
Xinchun Lu
Hwatsing Technology Co.,Ltd
Symposium V: CMP and Cleaning
Symposium V: CMP and Cleaning
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Analysis of thermal effects in chemical mechanical planarization (CMP)
Taesung Kim
Sungkyunkwan University
Application of ultra-low SG hard pad in CMP
Yijie Luo
HUBEI DINGLONG CO.LTD.
Backside Chipping improvement Study On Hybrid Bonding Process
Liang Tian
Semiconductor Manufacturing North China ( Beijing ) Corp ,China
A Novel Dynamic Hypergraph Attention Framework for The Prediction of Removal Rate in Chemical Mechanical Polishing Process
Zhenxiang Huang
China University of Mining & Technology-Beijing
Challenges and Solutions of Wet Processes in Semiconductor Manufacturing
Chen Chao
Beijing NAURA Technology Group Co., Ltd.
The compression deformation and particles removal of PVA brushes during the post-CMP cleaning process
Yu Li
ACM
Post Metal CMP Cleaning Technology Processes and Materials
Guanghong Luo
Yantai Xianhua Polymer Materials Ltd.
Improvement of W CMP Erosion Defect and Planarization Performance
Yu Yao
Semiconductor Technology Innovation Center (Beijing) Corporation, Beijing, China
RTPC X Pre-Thickness Control Function on Metal CMP Process
Mingtao Luo
Applied Materials
Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ruthenium Based Copper Interconnects
Zheng Wu
Hebei University of Technology
Uniformity and Defect Improvement in Dielectric CMP with Pad Dressing Optimization
Yu Yang
Shanghai Huali Integrated Circuit Corporation
How to Reduce Retaining Ring Wear
Jialiang Huang
Anji Microelectronics Technology (Shanghai) Co., Ltd.
Mesoporous CeO2 Particle Abrasives with High Specific Surface Area for Enhanced Chemical Mechanical Polishing Performance
Wei Yuan
Fudan University
A wafer-level CMP multi-physics modeling for IC manufacturing
Zhiwei Zhang
Zhejiang University
Effect of Surfactants on the Properties of C-, A- And M-Plane Sapphire CMP
Bin Hu
Hebei University of Technology
Study on the efficiency enhancement of chemical mechanical polishing of gallium nitride by acetic acid
Wenhao Xian
Hebei University of Technology
Study on the enhancement of surface quality of polyimide films by chemical mechanical polishing
Yafei Yin
Hebei University of Technology
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The Novel Strategy of Pattern Gate High Loading Controlling in ILD0 CMP Process
Shuxiang Wang
Shanghai Huali Integrated Circuit Corp
Application and Improvement of CU CMP Thickness Control Method Based on R2R System
Cheng Liu
Shanghai Huali Integrated Circuit Corporation
Study of Metal Film Thickness on Endpoint Detection in Chemical Mechanical Polishing (CMP)
Cheng Liu
Shanghai Huali Integrated Circuit Corporation
Study on the influence of surfactant concentration on the planarization effect of quartz wafers
Zian Ba
Hebei University of Technology
Application and mechanism research of novel green chelating agent in CMP
Lijun Dong
Hebei University of Technology
Hybrid Bonding Cu CMP Process Development
Yongbin Wei
Applied Materials
Investigation of Fe-Complex Catalysts in Tungsten Chemical Mechanical Polishing (CMP) with Passivation Layer Formation and Hydroxyl Radical Generation
Hyunho Kim
Sungkyunkwan University
Effect Of Green Surfactant ADS On Properties Of COPPER CMP SLURRY
Jiahui Li
Hebei University of Technology
Pad physical properties Effects on Removal Rate in a STI Ceria CMP Process
Jitao Chen
Shanghai Huali Integrated Circuit Corporation
Study On the Relationship Between Transmittance and Polish Time
Wangbing Li
Shanghai Huali Integrated Circuit Corporation
N28 Tech Node Metal CMP Profile Uniformity and Defectivity Improvement by RTPC-X MPC and JMP DOE Analysis
Likun Cheng
Applied Materials (China) Inc
RTPC X and RTPC XE application on Cu CMP
Yifeng Zheng
Applied Materials
Innovative Process Development on Wafer Quality & Throughput in SiC CMP
Zhenxing Song
Applied Materials (China)
STI CMP Uniformity Improvement by WIW iAPC
Yuan Li
Applied Materials
CU CMP 65nm intermetal residue issue solution
Ben Gu
Applied Materials
FullVision Endpoint System Application on Thick Dielectric Film CMP Uniformity Control
Weihan Zhu
Applied Materials
Improvement of UTM CU CMP Uniformity by RTPC-X Endpoint System
Mingzheng Han
Applied Materials
28nm SOI Tungsten CMP HDF step low range of post thickness achieved by RTPC X
Wanli Xing
Applied Materials
Accurate Profile Control of CMP Pad During Polishing Process
Yanjun Yu
Applied Materials
A Novel Cu Barrier CMP Process Tuning Study for Throughput Improvement
Jiaming Xu
Applied Materials (China)
Excellent Particle Performance with Brush Gap Optimization in Wafer House CMP Process
Qiang Chen
Applied Materila China
Use Damascus CMP to fabricate IGZO transistor in advanced Dram technology
Ming Zeng
Beijing Superstring Academy of Memory Technology
Poly CMP Surface Particle Improvement CIP
Tao Ni
Applied Materials (China), Inc.China
28HKMG STI inline performance improvement with FVXE application in
Mengyao Liu
Applied Materials
LK Defect improvement CIP in high-end wafer house product
Siyuan Pang
Applied materials
FullVision™ NIR Endpoint for Si CMP TTV improvement
Haodong Huang
Applied materials
The Effective Method of Cu Defect Improvement with New CIP Head Wash Nozzle
Mengxia Li
Applied material
OX and Cu selectivity Investigation on Cu CMP
Kun Zhang
Applied Materials China
HPPC Close Loop Control for FEOL CMP Process Stability and Productivity Improvement
Na Xiao
Applied Materials China
New optimized method to Slurry Arm for Metal RR NU Improvement Weiguo_Wang@amat.com
Weiguo Wang
Applied Materials
Cu defect improvement with BB2.0 function
Kewen Wang
Applied Materials China
Cu IM CMP Rs Control Capability Improvement
Youlai Xiang
Applied Materials China