FPGA-Based Test Platform for 56-Gbps NRZ Digital ICs and Systems
David Keezer
Eastern Institute of Technology
Symposium VI: Metrology, Reliability and Testing
Symposium VI: Metrology, Reliability and Testing
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Stuck-at and At-Speed Interconnect Tests for 3D-IC
Linyun Long
Sanechips Technology Co., Ltd
Test of higher-power Semiconductors: Challenges and Solutions
Hailin Wang
Elevate Semiconductor
A DFT test power consumption optimization technology
Chenchang Wang
Sanechips Technology Co., Ltd
Research On ps-Level Clock Skew Testing Solution for high-performance clock conditioner on V93000
Bank Liu
Advantest (China) Co., Ltd
Trends and Inflections in wafer metrology and inspection
Siqun Xiao
Applied Materials
In-Device SEM-based Overlay Metrology on VIA Layer of Logic Process
Chao Zhou
Applied Materials
Assessing Brittleness of Substrates and Thin Layers with Nanoindentation
Frank Zhang
KLA
Applications of Picosecond Laser Acoustics for Advanced Packaging
Johnny Dai
Onto Innovation
ADLPT: Improving 3D NAND Flash Memory Reliability by Adaptive Lifetime Prediction Techniques
Gang Qu
University of Maryland
Research on the root cause of THB failure of large size package chip to improve reliability
Yunhe Zhang
Sanechips Technology Co., LTD
Fault Sensitivity Enhancement for RRAM-based Neuromorphic Computing Systems
Ming Cheng
Shanghai Jiao Tong University
Highly Effective and Flexible Device Designs for High-Voltage ESD Protection
Leyan Wang
Semiconductor Manufacturing International (Shanghai) Corp.
Research on EOS Damage of Chips Caused by Abnormal CPU Power-off Sequence
Shilu Zhou
Sanechips Technology Co., Ltd., Shenzhen, China
High-speed ADDA Device Test Solution on V93000 ExaScale Platform
Ruiqiang Liu
Advantest (China) Co., Ltd.
Use IoT Technology to Optimize ATE Test Cell Operations and Management
Fangmin Chu
Advantest
Monitoring & Testing of Nanoparticle Contaminants
Lei Zhang
Winifred International Technology (Shanghai) Ltd., co.
Application of WSMX cards in sensor chip testing and the resulting simplification of test circuits
Liuhao Chen
Advantest (China) Co., Ltd.
Advanced AI-Based CD-SEM Metrology Solution for High-Throughput and High-Stability
Xinheng Jiang
Hitachi High-Tech
Timing Sequence Optimization Methods For Cross-Die Data Transmission
Jitong Zhou
Sanechips Technology Co., Ltd
Importance of MI (Metrology&Inspection) and Required Technologies in the EUV Era
Byoung-Ho Lee
Hitachi High-Tech Corporation
Cutting-Edge Optical Scatterometry and Spectral Interferometry Solutions for Advanced Packaging
Hila Shasha
Nova Ltd
V93K's solution to new test challenges for PMIC Device
Changqing Niu
Advantest China
Charge trapping defects in Al2O3/SiO2/Si structure characterized by spectroscopic second-harmonic generation
Yuchan Zhang
Shanghai Aspiring Semiconductor Equipment Co., Ltd.
Investigating Self-Test, Self-Diagnosis, and Self-Recovery (3S) Techniques for Wafer-Scale AI Chips
Cheng Liu
Institute of Computing Technology, Chinese Academy of Sciences
A Low-Cost Multiplexer Solution for IC Testing on the V93000
Jun Chen
Advantest
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A General Auto Configured Characterization Test Program Generation Solution on ADVANTEST V93K ATE Platform
Yefang Wang
Advantest (China) Co., Ltd.
An Optimized and General Class-D Audio Amplifier Crosstalk Measurement Test Solution on ADVANTEST V93K ATE Platform
Yefang Wang
Senior Application Engineer
PICOSECOND ULTRASONICS: AN ADVANCED TECHNOLOGY UTILIZED FOR PROCESS CONTROL OF SICR THIN FILM RESISTORS
Huayuan Li
Onto Innovation
A Common Building Block for Media SoC Analog Test on ADVANTEST V93000 ATE Platform
Hanyan Chen
Advantest (China) Co., Ltd.
Automatically Monitor and Process V93K Pattern for Large Scale High-speed Digital Devices on ADVANTEST ATE platform
Qingqing Xia
Advantest (China) Co., Ltd.
CD STEP APPLICATION IN EDGE AIR LAYER STRUCTURE MEASUREMENT FOR BULK ACOUSTIC RESONATOR
HONG HONG
Onto Innovation
The process of AVS establishment during testing and how to reduce power consumption at the application end
Liuhao Chen
Advantest (China) Co., Ltd.
Investigation of leakage risk on HV PNP ESD devices in LDMOS platform
Lei Li
Semiconductor manufacturing international corporation
Effective and Innovative ATPG solutions to shorten TTM based on V93000
Jun Chen
Advantest
Best practices for chip temperature testing in Automatic Test Equipment
Kaitao Liu
ADVANTEST
Satellite Device Tech Market Trends & RF Testing Challenges
Daniel Sun
ADVANTEST
Analysis and improvement of measurement accuracy of Insertion loss
Fan Hong
Aoshikang Technology Co., Ltd
The Investigation and Detection of Poly Residue Defect for 28 HKMG Process
Ruomu Li
Shanghai Huali Integrated Circuit Corporation
The Impact of PID on the Degradation of LDMOS
Wen Ying
Semiconductor Manufacturing International Corporation (SMIC)
A Continuous Data Sampling Solution for MEMS ASIC Test on V93000
Hao Wu
ADVANTEST
Understanding Electromigration Failure Modes in Cu Interconnects with Different Line Widths
Liting Hao
GHS Semiconductor
An Analytics Methodology For Anomaly Detection In Machine Log Data
Wei Yu
Shanghai Huali microelectronics corporation
Improvement of Optical Critical Dimension Metrology Accuracy Through Data Denoising
Lin Du
Shanghai University
Multi-core type chips binning solution on ATE
Haijing Wu
Advantest (China), Co., Ltd
Probe card stability in CP tests at high temperature
Wenting Xie
Advantest
High sensitivity Bright Field Inspection: Vera
Yingchao Liu
Applied Materials (China), Inc.China
Low-Frequency Noise Measurements for Electromigration Characterization of Cu Interconnect under Metal Barrier Punch Through Process Optimization
Chenxiao Xu
Zhejiang ICsprout Semiconductor Co., Ltd
5G Redcap Market Trend & Test Solutions on V93000
Daniel Sun
ADVANTEST
The Effect of Post Cooling Time of Single Wafer Annealing on TDDB Reliability
CunZhe He
Semiconductor Manufacturing North China
A feasible way to detect energetic molybdenum for CIS ion implantation process
Liang Hong
Applied Materials China
Effect of Medium Current Implant Beam Half Width on Resistance
Hui You
Applied Materials China
Galaxycore ADC Penetration and Performance
Yan Lv
Applied Materials China
The Improvement of HRP Resistance Uniformity by Beam Profile Optimization
Cheng Li
Applied Materials China
Abstract_An optimization method for monitoring nickel silicide process
Xiaolong Wang
Applied Materials China
Wafer Placement Control for Spike Anneal
Haifeng Zhu
Applied Materials China
A Comprehensive Investigation about Channel Size Effects on PBTI and SILC in Planar High-K MG NFETs
Sheng Chen
Shanghai Huali Integrated Circuit Corporation