Characterizing the Anisotropic Dielectric Constant of Package Material Considering the Fiber-Weave Effect
Wei Lin
JCET Group
Symposium VII: Packaging and Assembly
Symposium VII: Packaging and Assembly
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Advanced Packaging for CPO, Optical in Package Solution
Steve Jin
OPI Singapore
Advanced Panel Level Package Driven for Chiplet and Glass Core Technology
Tingyu Lin
Fozhixin Microelectronics Research Co., Ltd.
Study on Key-factors Analysis of ELK Dielectric Stress
Xiaoyan Li
Sanechips Technology Co.,Ltd.
A Streamlined Electro-Thermal-Mechanical Simulation Method for Power Semiconductor Packaging Design
ZI XIAO HUANG
Sinesemi (Shanghai) Semiconductor Co., Ltd.
Effects of Geometry and Surface Flatness on Direct Wafer Bonding by Multiphysics Modeling
Sichen Liang
Sun Yat-sen University
Cu Pad height Measurement for Wafer to Wafer Bonding Process by Utilizing SEM Quad-Detector
Yujie Xu
Hitachi High-Tech Corp
Application of System in Package Technology in Satellite Internet
Jin Yang
Southeast University
Investigating and Mitigating Gold Wire Stitch Breakage Failures in Tire Pressure Monitoring Sensor
Jingwei Sun
NXP
Solution to Sidewall Roughness of High Aspect Ratio TSV Etch in Advanced Packaging
Xinhe Zhou
Lam Research
AI-driven Optimization for FCBGA PKG RF SI
Shineng Ma
Sanechips Technology Co.,Ltd.
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Near Zero Residue High reliability Novel Solder Paste for Electronics
Yanfang Li
Indium Company
Long Process Kits Lifetime in Volaris2 for Pre-clean
Shiwei Zhang
Applied Materials
Comparison of simulation and actual test results and selection of molding material in Flip-Chip Package
Chong Dong
Sanechips Technology CO.,LTD.