Advanced MEMS Foundry and Industry-University Collaboration
Yuan Lu
Sai Microelectronics Inc.
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
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Integrated Fabrication and Applications of MEMS Devices on Ultra-thin Cylindrical Substrate
Zhuoqing Yang
Shanghai Jiao Tong University
Smart Micro-Electromechanical and Nano-Photonic Devices Enabled by a Phase Transition
Kaichen Dong
Tsinghua Shenzhen International Graduate School
Nanoelectromechanical Switches for Energy-Efficient Logic
Jinchi Han
Peking University
3D Micro-/nano-fabrication for High Performance Nanophotonics and Sensors
Faheng Zang
Shanghai Jiao Tong University
IC and MEMS Application in Gas Sensors
Anbo Guo
Semeatech Technology Co., Ltd. and Promisense Electronic Co., Ltd.
Neuromorphic Vision Sensor
Shi-Jun Liang
Nanjing University
Energy Intelligent Computing Devices Based on 2D Materials
Heejun Yang
Korea Advanced Institute of Science and Technology
Computational Design of Sustainable 2D Semiconductors, Interfaces and Devices
Yeesin Ang
Singapore University of Technology Design
Integration of 2D semiconductor based Transistors for Advanced Logic Nodes
Yuanyuan Shi
University of Science and Technology of China
Applications and Challenges of Voltage-Controlled Magnetic Anisotropy (VCMA)
Albert Lee
Inston Tech.
Embedded MRAM and Support Circuitry Design Considerations
Hao Cai
Southeast University
Highly Reliable RRAM Technology Development for Advanced Tech Node
Xiangchao Ma
Beijing InnoMem Technologies Co., Ltd
Investigation of Selector Characteristics for Scalable 1S1R Array
Gaoqi Yang
Peking University
Chip Tech for Life Science and Medicine
Chang Chen
Shanghai Jiao Tong University
Wearable Ultrasound Technology for Deep-tissue Monitoring
Hongjie Hu
Peking University
Functional Memristor for Biomimetic Sensory Computing
Suting Han
The Hong Kong Polytechnic University
Multi-dimensional Materials Integration for Smart Sensor Chips
Chen Wang
Tsinghua University
Advancing Material Innovations to Seamlessly Integrate Flexible Sensors with Rigid Chips
Yuqing Zheng
Peking University
Impact of Dielectric Environment and Thickness on MOS2 CVD Growth
Qiuxia Lu
University of Science and Technology of China
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A DESIGN STUCTURE OF THREE AXIS MEMS ACCELEROMETER WITH LOW CROSS-AXIS SENSITIVITY
Qing Xie
Fudan University
Possibility of Channeling Implant Application in SiC Trench MOSFET
Zhibo Zhang
Applied Materials
White-Pixel Performance Improvement on CIS VIISta Trident Application
Liangcong Du
Applied Materials