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Symposium III: Dry & Wet Etch and Cleaning

Symposium III: Dry & Wet Etch and Cleaning

Virtual Conference Registration
  • Download Agenda
  • CSTIC 2022 Call for Papers

Opening Remarks

  • Oral Session

  • Poster Session

  • 2-D Logic Device Scaling to Forksheet, and Technical Challenges to Nanosheet / Forksheet Configurations

    David Xiao

    IMEC

    Deep and Vertical Polyimide Etching

    Yuwei Kong

    NAURA

    Innovative Future Etch Technology by Atomic-order control

    Yoshihide Kihara

    TEL

    Practical Solutions to the Challenges of Quantitative Radical Species Sensoring in Process Plasmas

    Jianping Zhao

    TEL

    Release Process Development for MEMS Micro-Bridge Structure

    Bo Zhang

    HHGrace

    The latest development and results on CCP etch applications

    Abin Shin

    AMEC

    Perspective on Plasma Etching in Advanced Packaging

    Yuanwei Lin

    NAURA

    The Greenway of understanding Electronic Today's Cleaning's needs

    Patrick Duchi

    Inventec Performance Chemicals

    Manufacturing Process Optimization of Polycrystaline Aluminum and Aluminum Alloy on SiO2/Si

    Ping Linda Zhang

    Richmond Star Hi-Tech Consulting Inc.

    The Etching Morphology of Silver Study by Inductively Coupled Ar-Based Plasmas

    Zhongwei Jiang

    NAURA

    New Frontiers of Device Fabrication with Atomic Precision

    Peter Ventzek

    TEL, US

  • THE IMPROVEMENT OF AL-CU ALLOY CL-CORROSION RESISTANCE

    zoushifeng

    HHGrace

    Study on Low Power Back-side Deep Trench Isolation Etching on Stack-BSI CMOS Image Sensor

    Zhuo Yin

    Peking University

    Optimization of a Photoresist Trim Process with ICP Reactor

    Tianyin Sun

    Lam Research

    Selective TiN vs W Etch for 3nm and Below Applications

    Chien-Pin Sherman Hsu

    Avantor

    FinFET Gate Etch modeling by Coventor SEMulator3D®

    Hexin Zhou

    Lam Research

    Pre-Silicidation Clean Product for 5nm and Beyond Contact

    Biran Zhang

    Applied Materials (China), Inc.

    Gate-Cut Patterning Approaches Simulation and Defect Modelling by SEMulator3D®

    Sun Li Fei, Wang Qing Peng, Zhang Ji Hong, Chi Yu Shan

    Lam Research

    HNA Wet Etching Optimization in Wafer Thinning of BSI Process

    PengFei Lyu

    Lam Research Service Co., Ltd

    Improving Sidewall Roughness Performance through Shorten Phase Time RAP Process on Syndion tool in Deep Silicon Etching

    Sun Yiling

    Lam Research Corporation

    MRAM MTJ Ion Beam Etching Simulation

    Caigan Chen

    Lam Research Service Co. Ltd.

    FinFET Work Function Metal Recess Loading Improvement

    Caigan Chen

    Lam Research Service Co. Ltd.

    Si3N4 plasma etching study for optimized morphology performance

    Quanbao Li; Xiaohui Ren; Jihong Zhang; Yushan Chi

    Lam Research Service Co., Ltd

    Line Etch with HBr Cure Uniformity Study in Plasma Etch

    Xiaohui Ren

    Lam Research Service Co., Ltd

    Silicon Wafer Cleaning Optimization With Ozonated DI Water

    Jia Xu

    Lam Research

    Silicon Wafer Uniformity and Roughness Control by Etchants on Wafer Thinning

    Pin Chang, Li

    Lam Research

    Study on characteristics of ion beam emitted from optical system of ion source

    Yongjie Hu

    Jiangsu Normal University

    Etch Front Flatness Modification at Wafer Extreme Edge in a High Aspect Ratio Process

    Junming Wang

    Lam Research

    High Aspect Ratio Silicon Etch with High Selectivity to Tungsten

    Chun Gao

    Lam Research

    Peeling Defect Studying with N2/H2 Plasma during Carbon-based Recess Etch

    Tao, Ye

    Lam Research

    Bias Pulsing Plasma Etching for Polysilicon Gate Profile Control

    Yan He

    NAURA

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