- Symposium I: Device Engineering and Memory Technology
- Symposium II: Lithography and Patterning
- Symposium III: Dry & Wet Etch and Cleaning
- Symposium IV: Thin Film, Plating and Process Integration
- Symposium V: CMP and Post-Polish Cleaning
- Symposium VI: Metrology, Reliability and Testing
- Symposium VII: Packaging and Assembly
- Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
- Symposium IX: Design and Automation of Circuits and Systems