Copper corrosion issue analysis and study on advanced cmp process
Lei Zhang
HLMC
Symposium V: CMP and Post-Polish Cleaning
Symposium V: CMP and Post-Polish Cleaning
-
Galvanic Corrosion Caused by Device Structure in Chemical Mechanical Planarization
Guilin Chen
Zhejiang Hikstor Technology Co. Ltd
Post CMP Cleaning Study Of Ceria Slurry
Luping Liu
Zhejiang Hikstor Technology Co. Ltd
Effect of Oxone and Peroxodisulphates on the Chemical Mechanical Polishing Efficiency of C-plane GaN
Yebo Zhu
Hebei University of Technology
Preparation of ZnO doped SiO2 Abrasive and Chemical Mechanical Polishing Performance on C-plane Sapphire Substrate
Ziyang Hou
Hebei University of Technology
Analysis of Main Physical Factors of Chemical Mechanical Polishing About Lithium Tantalate
Ye Li
Hebei University of Technology
CMP for packaging and CIS
Angel Yang
Applied Materials
Effect of FA/O II Surfactant as a Complex Non-ionic Surfactant on Copper CMP
Yinchan Zhang
Hebei University of Technology
Successful iAPC controlling for solution of Endpoint Missing and T-Put improvement in CMP
Junjie Hu
Applied Materials
Multiscale Contact Behavior in CMP and its Correlation with Polishing Pad Properties
Ping Zhou
Dalian University of Technology
Investigation of Factor Inducing Edge over Erosion during Chemical Mechanical Polishing
Lixiao Wu
Lanzhou University of Technology
Research on the Formation of Sub-nano Depth Scratches on the Crystal Surface During Chemical Mechanical Polishing
Han Xiaolong
Dalian University of Technology
Effects of surfactants on Cu-Co galvanic corrosion in post-CMP cleaning
Wang Yazhen
Hebei University of Technology
Steady Clean for Stable Particle Performance Improvement
Yunlong Wu
Applied Materials
-
IAPC WiW control '150mm' Wafer Edge Profile
Junyi Hu
Applied Materials
Enhancement of process stability by using HPPC
Yongbin Wei
Applied Materials
Evo Head and WiW iAPC for ILD CMP Far Edge Profile Control
Youlai Xiang
Applied Materials China
RTPC Algorithm Optimization to Eliminate Wafer Edge Residual for Cu CMP
Yunhong Hou
Applied Materials
Effect of PASP Inhibitor on Cu-Co Galvanic Corrosion
Haoran Li, Baoguo Zhang, Ye Li, Xiaofan Yang, Wei Wei, Zhaoxia Yang
Hebei University of Technology
Research on improvement of CMP thickness uniformity control on wafer edge defocus defects
ZengyiYuan
HLMC
SAC CMP Uniformity of Selectivity Significant Improvement for 14 nm CMOS Process
Guoan Wu
Applied Materials (China), Inc.
Preclean effective application for Poly film defect performance
Jian Xiao
Applied Materials
Role of 1-H Carboxyl Benzotriazole as Corrosion Inhibitor for Cobalt "Bulk Step" CMP in H2O2 Based Alkaline Slurry
Shuangshuang Lei
Hebei University of Technology
Effect of TTA-K as Inhibitor on Cu/Ru/TaN Structure based Patterned Wafer CMP
Tian Yuan
Hebei University of Technology
Role of FA/O II Complexing Agent and BIT on Dishing and Erosion Reduction during Cu Barrier CMP
Zhihui Cui
Hebei University of Technology
INVESTIGATION ON THE MATERIAL REMOVAL PROCESS OF COPPER BY A SINGLE PAD ASPERITY
Haipeng Li
Dalian University of Technology
A Novel High-performance pad conditioner for 3D NAND STI CMP
Mengxia Li
Applied Materials
Sponsors:
