Mass Metrology Solution for 3D Process-Monitoring
Jiangtao Hu
Lam Research, US
Symposium VI: Metrology, Reliability and Testing
Symposium VI: Metrology, Reliability and Testing
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Implementation of Spectral Interferometry for Enhanced Critical Dimensions Optical Metrology
Roy Shtainman
Nova Measuring Instruments
Advantages of Picosecond Ultrasonic Technology for Advanced RF Metrology
Johnny Dai
Onto Innovation
Mid-Infrared Critical Dimension Ellipsometry and Advanced Machine Learning to Address Complex Semiconductor Manufacturing Metrology Challenges
Franklin Wong
Onto Innovation, US
Inline Thickness Measurement for Thick Amorphous Silicon Film by Spectroscopic Ellipsometry Method
Bo Zhang
HHGrace
OCD Signal Study under the Normal and Oblique Incidence Metrology Architectures
Aihua Yang
Shanghai IC R&D Center
Mask Design method for Un-patterned Dark Field Defect Inspection System
Shuang Xu
Wuhan University of Science and Technology
Complex Protocol Construct System on ATE Platform
Man Cao
Advantest (China) Co., Ltd.
Test challenges for 5G wireless base station application device
Xin Song
Advantest (China) Co., Ltd.
Universal Semiconductor ATPG Solutions for ATE Platform under the Trend of AI and ADAS
Qimeng Wang
Advantest
PICA analysis of CMOS Circuits Using SIL Measurement PICA analysis of CMOS Circuits Using SIL Measurement
Lin Shang Chih
Gallant Precision Machining Co.,Ltd.
Backside Defect Monitoring Strategy And Improvement In The Advanced Semiconductor Manufacturing
JianGang Zhou
HLMC
Convolutional Neural Network (CNN) Based Automated Defect Classification (ADC) with Imbalanced Data
Hairong Lei
ASML-HMI
A Novel Wafer-map Similarity Search System with High Speed and Accuracy
Chang Xu
Fujian Jinhua Integrated Circuit Co., Ltd.
Full Chip Reliability Verification by Netlist Driven Layout Methodology
Jonathan White
Synopsys, US
Reliability Challenges and Inline Metrology - an Effective Approach to Implementation in Advanced Devices
Daniel Fishman
Nova Measuring Instruments
The Gate Length Dependence of Single Event Upset in 14nm bulk and SOI FinFET SRAM Cells
Jingyi Liu
Peking University
Board-level thermal cycle simulation and improvement of 2.5D large-size package
Shiyu Chen
ZTE Corporation
THROUGHPUT IMPROVEMENTS VIA LOGISTICS IN CURRENT SEMICONDUCTOR FACTORIES
George W. Horn
Middlesex Industries Sa
350 kg Sapphire Inspection Facility Open Doors for Complete Defect Traceability across LED Manufacturing Process
Ivan Orlov
Scientific Visual
R2R Based Alternating Direction Method of Multi-parameter Control Strategy
Huating Huang
Fujian Jinhua Integrated Circuit Co., Ltd.
A Dynamic Sampling Algorithm based on Cost-Risk Assessment Model in Semiconductor Manufacturing
Sen Wang
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC)
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New Register Configuration Solution for High Speed IO Test
Tianyu Zhang
Advantest
EFFECTS OF DIFFERENT GATE STRESS CONDITIONS ON HOT CARRIER INJECTION IN HIGH VOLTAGE N-CHANNEL CMOS
Lei Li
SMIC
A New Solution of Power Management IC One Time Programable Test
Yong Liang
NXP Semicondoctors
Reliability Investigation between 2-terminal and 4-terminal Kelvin Structure in Terms of WLR IsoEM and PLR EM for Metal Interconnection
Dingrui Zhang
SMIC
Electro-migration Behavior Study on Metal Line Width and Length of AlCu Interconnects
JiZhou Li
SMIC
Experimental Study on Void Growth and EM Performance under DC Reversal
Dingrui Zhang
SMIC
Defect principle and improvement of 28nm germanium silicon epitaxial growth process
Qu Yan
HLMC
The Strong Effect of Spectral Mode and Directional Electrical Field for Nuisance Filtering in Defect Inspection
Xingdi Zhang
HLMC
Impact of the stress on reference voltage of power SIP chip applied in 5G based station
Qiong Jin
ZTE Corporation
A Method to Enhance the Hot Carrier Injection Effect of IONMOS device
Shuang Jiao
HLMC
ATE Test Solution for High Resolution and High Voltage DAC
Tianyu Zhang
Advantest
Machine Learning Based Prediction of aging caused path-delay degradation
Qi Wei
ZTE Sanechips Corporation
THE INVESTIGATION OF INLINE TINY BUBBLE DEFECT INSPECTION AND SOLUTION FOR 14NM PHOTOLITHOGRAPHY PROCESS
Yin Long
HLMC
Wafer Defect Classification Based On DCNN Model
Pan Tian
ICRD
Research on restoration of color object in Computational Holography based on Genetic Algorithm
Yufei Liu, Shuang Xu , Cheng Liao , Chao Liu
Wuhan University of Science and Technology
Design optimization of GaAs/AlGaAs lasers epitaxially grown on Si substrates with threading dislocation density in the range of ~106 cm-2
Yugeng Shi
Sun Yat-sen University
FAULT DETECTION OF SENSOR DATA IN SEMICONDUCTOR PROCESSING USING NEURAL NETWORK WITH DYNAMIC TIME WRAPPING LOSS
Wang Yong
HLMC
STUDY ON RETEST REDUCTION BY MINIMIZING PROBE CARD CONTACT RESISTANCE AT WAFER TEST
Demi Li
NXP Semiconductors (Tianjin)
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