TSV and Hybrid Bonding Solutions for 3D Heterogeneous Integration Packaging Applying in next AI / HPC Era
Albert Lan
Applied Materials
Symposium VII: Packaging and Assembly
Symposium VII: Packaging and Assembly
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The Development of 3D IPDs on Glass Wafer
Daquan Yu
Xiamen University
Innovative PVD Technology Solutions for Advanced Substrate, Backside Metal and EMI Shielding
Jeff Turner
Applied Materials
Heterogeneous Integration Driving New Packaging Technologies
Nirmalya Maity
Applied Materials
Next generation high performance, six-pack double side cooled IGBT power module for EV/HEV applications
Yaqing Ma
Jiangsu HHCK advanced materials Co., Ltd.
Important Considerations of Selecting Wafer/Panel-level Die Pick & Place Tool For High Volume Manufacturing
Percy Lam
ASM Pacific Technology Ltd.
ASHING PROCESS ON WARPAGE WAFER WITH LOW DAMAGE
Zihan Dong
NAURA, Beijing
Conformal Coating Process Optimization for Limiting Bubbles Formation
Rexel Macaraya
Integrated Micro-Electronics Inc.
Electrochemical Migration (ECM) Prevention in Gate to Source of MOSFETs of Insulated Metal Substrate PCB Assembly
Rexel Macaraya
Integrated Micro-Electronics Inc.
First Pass Yield Gain Strategies during Tri-Temperature Automotive Package Test
Jerry Broz
International Test Solutions
Research on the Thermal Reliability of Multi-unit PIM
Juan Hu
Huangshan University
A Study Of Thermal Interface Materials With Different Thermal Conductivity For HFCBGA Package
Feng Wang
ZTE Corporation
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A Micro Soldering Method to Improve Strength Between Bonding Pad and Wire
Li He
Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP)
Effect of Bi content on the microstructure and mechanical properties of Cu/Sn-Bi/Cu solder joints after soldering and aging
Mingliang Huang
Dalian University of Technology
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