Advanced Packaging Architectures for Advanced Heterogeneous Integration (HI)
Ravi Mahajan
Intel
Symposium II: Lithography and Patterning
Symposium II: Lithography and Patterning
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Negative-tone imaging (NTI) for advanced lithography with EUV exposure to improve 'Chemical Stochastic'
TORU FUJIMORI
FUJIFILM Corporation
Progress and outlook towards High-NA EUV materials
Jara Garcia Santaclara
ASML
HIGH PERFORMANCE BULK AND POU FILTRATION OF EUV LITHOGRAPHY MATERIALS
Lucia D’Urzo
Pall
Development of planarizing spin-on carbon material for high-temperature processes
Runhui Huang
Brewer Science Inc.
Contour based process characterization, control and hotspot prediction for semiconductor manufacturing
AO CHEN
Mentor, a Siemens Business
The Setting of Linewidth Reference on Photomask through Physical Process Modeling
Rui Hu
ICRD
SEM Image Transformation between Litho Domain and Etch Domain
Yan Yan
ICRD
ML enhanced full-flow design guided wafer defect analysis and reduction
Qian Xie
Mentor, a Siemens Business
Full Chip Curvilinear ILT with both Multi-Beam and VSB Mask Writers That Doubles Wafer Process Windows
Leo Pang
D2S
Optical Proximity Correction (OPC), Methodology and Limitations
Yongqiang Hou
ICRD
Update of >300W High Power LPP-EUV Source Challenge III for Semiconductor HVM
Hakaru Mizoguchi
Gigaphoton
193i lithography’s path to the future
Stephen Renwick
Nikon Research Corp of America
Nanoimprint Performance Improvements for High Volume Semiconductor Manufacturing
Keita Sakai
Canon Inc.
Extending the capability of lithography with mechanical processes
Huigao Duan
Hunan University
An innovative graphical platform for real time accurate AEI overlay prediction and rework control
Xue Huang
YMTC
A New Generation Cost-efficient Laser Mask Writer for Mature Semiconductor Nodes
Peter Henriksson
Mycronic AB
Reference Metrology Using 3D-PSD of Post-Etch LWR
Masami Ikota
Hitachi High-Tech Corp.
Feed-forward correction of on-product overlay using standalone alignment technology
Masahiko OKUMURA
Nikon Corporation
Overlay metrology based on Mueller matrix scatterometry
Hao Jiang
Huazhong University of Science and Technology
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The photoresist developing ability study at different contact angle and mask transmission rate
Chen Lijun
Shanghai Huali Microelectronics Corporation
The Mechanism Study of Rounded AA Damage Defect after POLY Loop
Zheng Haichang
Shanghai Huali Microelectronics Corporation
Contour extraction for SEM image based on deep learning method
Li Chen
Shanghai IC R&D Center
Extreme edge uniformity control study in Poly-Si Planarization etch
Minxiang Wang
Lam Research Service Co., Ltd
Mining Lithography Hotspots from Massive SEM Images Using Machine Learning Model
Zhou Tao
Shanghai IC R&D Center
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