Lithography Material Challenge
Allen Chang
JSR, Taiwan
Symposium II: Lithography and Patterning
Symposium II: Lithography and Patterning
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Co-advancing Scaling Techniques and Functionality Enhanced Potential Device Infrastructures
David Xiao
An ocean of opportunities in a fast growing market using ASML TWINSCAN systems
Henri van Helleputte
ASML Netherlands B.V.
A Positive-Tone Photosensitive Polyimide Material for Semiconductor Packaging
Yongqiang Wang
Jinan ShengQuan New Materials Limited
Recent progress of EUV resist development for improving Chemical Stochastic
TORU FUJIMORI
FUJIFILM Corporation
From micro to nano, and beyond, --- Measuring Innovations ---
Zhigang Wang
Hitachi High-Tech Corporation
Modification of Organic Underlayer by Plasma During Dry Etching and its Effect on the Film Properties
Soojung Leem
DuPont Electronics & Industrial
CycleGan-based mask diffraction model
Yijiang Shen
Guangdong University of Technology
Illumination optimization for the BEOL DTCO with 45 degree local interconnection
Xianhe Liu
Fudan University, School of Microelectronics
Process and tool monitor and diagnosis based on overlay data and modeling
Yi Tong
Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou, China
The Analysis of Optical Critical Dimension Signal Strength Between 5 nm FinFET and 3 nm CFET Vertical Gate Stacks
Qi Wang
Fudan University
The Possibility of Using 193 nm Immersion Lithography Process for 5 nm Logic Design Rules
Qiang Wu
Fudan University
Enhancement of pattern depth in plasmonic lithography for practical application
Dandan Han
University of Chinese Academy of Sciences
DUV Mask Writer addressable to 90nm nodes with a Sustainability Profile
Youngjin Park
Mycronic Co., Ltd.
Patterned wafer defect inspection at advanced technology nodes
Jinlong Zhu
HUST
