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China Semiconductor Technology International Conference (CSTIC) 2023

中国国际半导体技术大会

China Semiconductor Technology International Conference (CSTIC) 2023

中国国际半导体技术大会

  • CSTIC 2024 Call for Papers
  • Committees
  • Keynote Speakers
  • Training Courses
  • Symposiums
  • Sponsors

Welcome to CSTIC 2023, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE, co-organized by Institute of Microelectronics, Chinese Academy of Sciences and SAMT. CSTIC 2023 has been held on June 26-27, 2023 in Shanghai, China. Virtual conference will be held from June 29 to July 26. The conference has nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.

**Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.

Plenary Session

Committees More

  • Dr. Hanming Wu

    Conference Chair

  • Dr. Beichao Zhang

    Conference Executive Co-Chair

  • Prof. Ru Huang

    Conference Co-Chair

  • Prof. Cor Claeys

    Conference Co-Chair

  • Dr. Steve X. Liang

    Conference Co-Chair

  • Dr. Qinghuang Lin

    Conference Co-Chair

Keynote Speakers More

Spintronics for Greener Digital Technologies and Prospects Far Beyond

Prof. Albert Fert

Research Director Unité Mixte de Physique , Nobel Laureate in 2007

View

Innovations Boost Integrated Circuit

Prof. Ming Liu

Academician of CAS, Fudan University

View

Advanced Packaging Technology Challenges: an Equipment Supplier's Perspective

Dr. Yang Pan

null Lam Research

View

The Challenge of China's Semiconductor Equipment

Mr. Jinrong Zhao

Chairman of the Executive Committee, Beijing NAURA Technology Group Co., Ltd.

View

From Legacy to Leading Edge: Broadband Wafer Optical Inspection for Process Control

Dr. Yalin Xiong

Senior Vice President and General Manager, KLA Corporation

View
Sponsors:
Organizers:
Co-Organizers:
Co-Sponsors:
Proceedings Publication:

Training Courses More

  • 93

    Lithography process and key technical aspects in exposure tools, materials, and the future development roadmap

     Dr. Qiang Wu Professor, Fudan University
  • 95

    Post CMP Cleaning

     Prof. Jin-Goo Park Professor, Hanyang University, Korea

Parallel Symposiums

  • Symposium I: Device Engineering and Memory Technology
  • Symposium II: Lithography and Patterning
  • Symposium III: Dry & Wet Etch and Cleaning
  • Symposium IV: Thin Film, Plating and Process Integration
  • Symposium V: CMP and Post CMP Cleaning
  • Symposium VI: Metrology, Reliability and Testing
  • Symposium VII: Packaging and Assembly
  • Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
  • Symposium IX: Design and Automation of Circuits and Systems

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