Trimming of Silicon Nitride Hard Mask Using Cyclic Deposition and Etch Process
Li Tian Xu
Beijing NAURA Microelectronics Equipment Co. Ltd
Symposium III: Dry & Wet Etch and Cleaning
Symposium III: Dry & Wet Etch and Cleaning
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Ion Beam Etching as a Patterning Solution for AR/VR Applications
Yuxin Yang
Leuven Instruments
The Investigation of CF3I for High-aspect-ratio Cryogenic Dielectric Etch
Jianqiu Hou
AMEC
Optimizing SiARC Residue Reduction Methods with Minimizing Profile Change
Xingxing Xu
Lam Research
A Study of NAND Flash Device Cycling Performance Improvement via FG Carbon-doped Polysilicon and Channel Corner Rounding
Jun Wang
Semiconductor Manufacturing North China (Beijing) Corporation(SMNC)
The challenges and perspective solutions of TSV etching for 3D and 2.5D applications
Guorong Li
Beijing NAURA Microelectronics Equipment Co., Ltd.
8-inch CCP Etch Solutions for the Emerging Devices
Dongsan Li
Beijing NAURA Microelectronics Equipment Co., Ltd.
Enabling Plasma Etch Solution for GaN Technology
Chunxiang Guo
Jiangsu Leuven Instruments Co., Ltd.
Effect of Process Gas on Side Wall Angle in Silicon Trench Etching
Yiming Ma
Beijing NAURA Microelectronics Equipment Co., Ltd
Optimization of SADP Process for Tiny Bridge Defect Reduction in Planar 2D NAND Flash
Jun Wang
Semiconductor Manufacturing North China (Beijing) Corporation(SMNC)
Beyond 20nm DRAM Dielectric Etch Introduction and Position
Zengwen Hu
AMEC
Distortion Control when Etching Dram Metal Contact
Jianqiu Hou
AMEC
AMEC Etch Product Innovation for Advanced Technology and MtM Applications
Wuping Liu
AMEC, China
The Plasma Etching of the Deep Hole Structure in Silicon with the Mixed Gas of SF6, HBr and O2
Qifei Wang
Beijing NAURA Microelectronics Equipment Co., Ltd
Mechanism of SiC Reactive Ion Etching in SF6O2Ar Inductively Coupled Plasma
Anton Kobelev
Suzhou STR Software Technology Co., Ltd
A Novel Method to Eliminate Pad Crystal
Fred Meng
Guangzhou CanSemi Technology Inc.
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A Study of Fin Profile Tuning in Advanced DRAM Buried Word Line Etching
Yao Kevin
Lam Research
FTT and Lookahead Function Reduced Hydra® ESC Temperature Stabilization Time
Li Zhe
Lam Research
Symmetric spacer etch in SAQP with advanced RF pulsing
Yuyang Sun
Lam Research
Advanced Mixed Mode Pulsing in DRAM High Aspect Ratio Punch
Zheng Ruan
Lam Research
Plasma Treatment Effect on Line Width Roughness Improvement
Shipeng Gong
Lam Research
Application of Advanced RF Pulsing for DRAM Patterning LCDU Improvement
Hui Xu
Lam Research
Local CD Uniformity (LCDU) improvement in DRAM Capacitor Hard Mask Etch
Nick Fang
Lam Research
Line Width Roughness and Critical Dimension Uniformity Improvement in Self-Aligned Contact patterning in DRAM
Julia Zheng
Lam Research
Control of Landing Hole Shape in DRAM Contact Etch
Liubo Ma
Lam Research
Control of Landing Hole Shape in DRAM Contact Etch
Liubo Ma
Lam Research
Striation Improvement in Dual Damascene Via Etch with Capacitively Coupled Plasma
Wei Wang
Lam Research
300mm Wafer Thinning Uniformity Improvement
Bowen Dai
Lam Research
Chamber Condition Indicated by Mahalanobis Distance in Lam EI-DA
Jeremy Wu
Lam Research
Electronic Chemical Plating Gap Fill Improvement by Chemical Concentration and Plating Current
Bruce Fan
Lam Research
Wet Etch Resistance Improvement of PECVD SiN by Hydrogen Concentration Optimization
Dandan Qi
Lam Research
Novel Inline Thickness Measurement System Of Ultrathin Wafer Thickness Control For Power Device
Haibo Liu
Lam Research
A Study on Si Cavity Formation by Combination of Isotropic Wet Etch and Anisotropic Dry
Tianhao Zhang
Lam Research
Optimizing Metallic-Based Polymer Removal in the Indium Tin Oxide Etching
Quanbao Li
Lam Research
Efficient Solution to Chamber Matching by Equipment Intelligence®-Data Analyzer
Wan Hsuan Wu
Lam Research
ACHIEVEMENTS ON CONFORMABILITY OF SILICON NITRIDE FILM AFTER WET-ETCHING
Wenbo Lou
Piotech
The TaN Metal-Insulator-Metal (MIM) Dry Etching Residue Removal in Inductively Coupled Plasma Process
Wenda Jia
Lam Research
Study on W Filling Void Improvement by Chamfered Gate
PengFei Lyu
Lam Research
Selective Bottom Layer Punch-Through in High Aspect Ratio TSV For Advanced CIS Processing
Ruxun Yuan
Lam Research
Study of Etch Rate and Profile Control by NF3/CL2/O2 Chemistry on W Grid Etch for CMOS Image Sensor (CIS)
Yayu Hong
Lam Research
The Influence of Fin Recess Shape on Device Performance
Ya-Ming Liu
Lam Research
Fin Physical Structure Impact on Device Performance
Li Fei Sun
Lam Research Service Co., Ltd
Si Wafer Breakage improvement by Recipe Optimization
Chunlong Qiu
Applied Materials China
Study of Etch Chamber Wall Coating Impact on Process Performance
Songtao Lv
Applied Materials