Cell structure and process integration of a novel 2T0C technology for high-density DRAM application
Zhengyong Zhu
Beijing Superstring Academy of Memory Technology
Symposium IV: Thin Film, Plating and Process Integration
Symposium IV: Thin Film, Plating and Process Integration
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Xiaoping Shi
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Pathfinding by different process integration scheme: Advanced DRAM bit-line spacer process integration skim evaluation using virtual fabrication
Dempsey Deng
Lam Research
Carbon Gap Fill in Reversed Self-Aligned Double Patterning
Guanfeng Lu
Lam Research
Atomic Scale Engineering: An outlook of ALD Applications and Localization
Weiming Li
Jiangsu Leadmicro Nano-Equipment Technology Ltd.
Study of Slip Defects and Improving Methods in Furnace High Temperature Process
Yan Sun
NAURA
Surface Process Development for High-performance GaN HEMTs Fabrication
Min Xu
Fudan University
Precursor Selection for ALD High-k Films in Memory Applications
Jianheng Li
Hefei ADChem Semi-Tech. Co., Ltd.
Si and SiGe Heteroepitaxy for Semiconductor Quantum Computing
Guilei Wan
Beijing Superstring Academy of Memory Technology
High Mobility SiGe/Ge Channel Transistors for Advanced CMOS Technology
Yi Zhao
East China Normal University
A Novel Method to Optimize SiGe Profile Using Co-implantation
Zhiqiang Xiao
Semiconductor Manufacturing North China (Beijing) Corporation(SMNC)
Pulsed DC parameters (Reverse Voltage, Duty Cycle, Pulsed Frequency) on Film quality in reactive sputtered aluminum nitride films
Wei-Yu Zhou
National Central University
The effect of SiGe SiCoNi pre-clean time on planner logic device performance study
Xuechun Zhang
SMNC
Growth and Reduction of Tiny defect in Selective SiGe Epitaxy S/D Devices
CunZhe He
SMNC
Influence of ion implantation on void defect formation in epitaxially grown silicon
Zeqi Zha
SMIC
Some key modifications of theory required to understand the leakage current mechanisms for ferroelectric HfZrO capacitors used in microelectronics
Wai Shing Lau
Nanyang Technological University
Lau’s unified Schottky-Poole-Frenkel theory with asymmetric distortion by electron charge trapping proposed to explain the current-voltage characteristics of high-k metal-insulator-metal capacitors
Wai Shing Lau
Nanyang Technological University
The Study of Silicon Nitride Films Deposited in Batch ALD System
Shiyao Cheng
Beijing NAURA Microelectronics Equipment Co., Ltd
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Surface Roughness Reduction of PECVD SiNX Film
Xiaochen Wang
Piotech Inc.
Mechanical Properties of Flip-chip Bonding Structures for Micro-LED Devices: Cu-Cu Bonding with Passivation Layer and Indium Bumps Bonding
Kefeng Wang
Shanghai University
WN Barrier Simulation for Electrical Improvement in Small CD BEOL vias Application
Zhengning Gao
Lam Research
Virtual DOE-assisted DTI Airgap Optimization
Cherry Xu
Lam Research Service Co. Ltd.
Electroplating Process Improvement on Post-CMP Dishing Profile
Joey Hu
Lam Research
Effect of Sub-Atmospheric Chemical Vapor Deposition SiO2 Film Deposition Process on Surface Chemistry Sensitivity
Jianan Wei
Piotech
Gas distribution effect on AlN thin film Thickness Non-uniformity
Xiaomeng Liu
Piotech
Substrate Effect on Thermal ALD AlN thin film Gwoth Rate
Xiaomeng Liu
Piotech