Power-Aware Testing for Low-Power VLSI Circuits
Xiaoqing Wen
Kyushu Institute of Technology
Symposium VI: Metrology, Reliability and Testing
Symposium VI: Metrology, Reliability and Testing
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Build-in Fault-Tolerant Computing Against Silent Data Corruptions
Huawei Li
ICT, CAS
Innovation Test Technology for Ultra-High-Speed ADC on ATE
Yanyan Chang
Advantest
Ultra-Wideband (UWB) Test Solution on V93000
Daniel Sun
Advantest
General Chip Digital Data Obtaining Solution on ATE
Steve Xie
Advantest
BB-AP High Parallel Test Solution in V93000 ExaScale Platform
Tianyu Zhang
Advantest
A Novel Model-Matching Based Scratch Tool Tracing System
Shi-Qiang He
Fujian Jinhua Integrated Circuit Co.,Ltd
Faster Au-Al IMC growth under chlorine environment
Lois Liao
Wintech-nano
Reliability Research on micro bump and c4bump in Large-Size 2.5D FCBGA
Xiang Li
Applied Materials
Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package
Zhuolun Wu
Sanechips Technology Co., Ltd.
DPU (Data Processing Unit) enabling the Next-gen Computing System
Guihai Yan
ICT, CAS
An Efficient Tool for Generating Test Program to Save Marginal Fail Chips
Hanyan Chen
Advantest
A universal auto test program generation on ADVANTEST V93000 ATE platform
Xin Song
Advantest
Early Fault-analysis using in-line Raman Spectroscopy
Roy Pinhassi
Nova Ltd
A Methdology for Testing Scan Chain with Diagnostic Enhanced Structure
Shuai Wang
Sanechips Technology Co., Ltd.
A Novel Method to Achieve High Efficient Iteration of Mbist Pattern
Feilong Pan
Sanechips Technology Co., Ltd.
Impact of Interface Trap Density on the Endurance of HfO2/Si FeFETs
Jiaqi Zheng
Zhejiang University
Impact of Interface Traps Generation on Flicker Noise Degradation in Si pMOSFETs
Yi Jiang
Zhejiang University
Research on Hot Carrier Injection Optimization of 28HKMG Technology
Weiwei Ma
HLMC
Applications of Picosecond Laser Acoustics to Power Semiconductor Device: IGBT and MOSFET
Johnny Dai
Onto Innovation
RC-Triggered Silicon Controlled Rectifier-based ESD Clamp with Fast Transient Reaction
Lingran Pan
Zhejiang University
Ultra-high-throughput inline probe metrology and inspection
Lei Feng
Infinitesima Ltd
Innovations in Integrated Metrology
Ilya Osherov
Nova Ltd
Computer Vision Technology Supported Rapid DRAM Capacitor Analyzing System Based on TEM Image
Chang Xu
Fujian Jinhua Integrated Circuit Co., Ltd.
Calibration of pitch standards of SEM for semiconductor dimension metrology application
Wei Li
National Institute of Metrology
Virtual Metrology Modeling for CVD Film Thickness with Lasso-Gaussian Process Regression
Shijia Yan
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC)
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The Improvement Study of UTS CIS Bevel Peeling Defect Based on the Application of SEM API
Xianghua Hu
HLMC
Study on E-Beam Induced Deposition with Gas Injection System
Fan Zhang
SMIC
Methods for Fin Etching profile maintaining and measurement
Xu Yun
SMIC
Investigation of Different Gate Bias on PMOS HCI Performance
Lei Li
SMIC
Research on TDDB physical mechanism of 28HKMG MOSFET
Ting Wan
HLMC
Reservoir Effect Study on Electro-migration Behavior of AlCu Interconnects
JiZhou Li
SMIC
The verification of TDDB acceleration model in ultrathin gate oxide
Wen Ying
Semiconductor Manufacturing International Corporation(SMIC)
Design and optimization of RC triggered MV-NMOS for 28nm CMOS Technology ESD protection
Jia Zhu
SMIC
Application of Picosecond Ultrasonic Technology for CMOS Image Sensor
Johnny Mu
ONTO Innovation
Neutron Irradiation Induced Carrier Removal and Deep Level Trap in n-GaN Schottky Barrier Diodes
Jin Sui
Shanghaitech University
MetaVit-Trans: A framework for mixed-type defect detection of wafers with Vision Transformer combined with meta-learning and transfer learning
Junfeng Zhao
Northeastern University
Lithography Hotspot Detection Based on Transfer Learning with High Resolution Networks
Hongzhe Wang
Northeastern University
An End-To-End Detection Approach for Micropipe Defect of Sic Wafers Via Fusing Multiple Hierarchical Features
Wenxin Shi
Tsinghua University
An Automated Microscope Inspection Platform SiC Wafer Defect Detection
Tiangang Zhao
Tsinghua University
A Real-Time Detection Method for Wafer Probe Reference Die Shift
Xiaofeng Liang
NXP semiconductor (China) Ltd.
Novel Localization Approaches in Metal –Insulator-Metal Structure Failure Analysis
Lvye Fang
SMIC