Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration
Len Tedeschi
Applied Materials
Symposium VII: Packaging and Assembly
Symposium VII: Packaging and Assembly
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Development of 3D Embedding Glass Wafer Fan-Out Technology
Daquan Yu
HuaTian Technology
Integrating High Frequency Radar Chip using Laminated Substrate Transitions for System-in-Package Design
Zhiqiang Fang
JCET
Electromagnetic interference shielding solution for System-in-Package
Jiongjiong Gu
JCET
Printable Copper Sintering Paste for High-Power Die-Attach Application
Li Ma
Indium corporation
A Negative-Tone Photosensitive Polyimide (PSPI) Material for Semiconductor Packaging Applications
Peng Li
Jinan ShengQuan (SQ) New Materials Limited
