Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications
Zongbin Wang
Applied Materials
Symposium IV: Thin Film, Plating and Process Integration
Symposium IV: Thin Film, Plating and Process Integration
-
A Review in III-Nitride Nanocolumns Growth and Applications
Enrique Calleja
Universidad Politécnica de Madrid
Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects
Zhuo-Jie Wu
HFC Semiconductor
Optimization of Deep Trench Isolation on 0.18μm SOI BCD Technology for Automotive Application
Siti Aisah Mohd Salleh
X-FAB Sarawak Sdn. Bhd.
The Progress and Challenges of Large Scale Integration of Silicon Photonics
Adam Lewis
CUMEC
Do we need 300mm GaN-on-Si?
Kai Cheng
Enkris Semiconductor,Inc
Si based GaN HEMTs/System R&D and the perspective of the technological commercialization
Hongyu Yu
Southen University of Science & Technology
Thin Film Atomic Layer Deposition and Selective Processes
Rong Chen
Huazhong University of Science and Technology
A Chemistry Perspective of ALD Precursors' Properties
Xiabing Lou
Origin Deposition Materials Co., Ltd.
CHARACTERIZATION OF ALD LOW-K FILMS
Wenxu Duan
Beijing NAURA Microelectronics Equipment Co., Ltd.
ALD of Dielectric Materials: Analysis of Equipment Design and Process Performance Using Detailed Modeling
Yanlin Mao
Suzhou STR Software Technology Co., Ltd.
Design Technology Co-optimization for Yield and Reliabulity Enhancement of RRAM Technology Platform
Zhichao Lv
Reliance Memory
The effect of stress on HfO2-based ferroelectric thin films
Feng Luo
Nankai University
SiGe/Si Heteroepitaxial Epitaxy and Characterization for CMOS and Vertically Stacked DRAM
Guilei Wang
Beijing Superstring Academy of Memory Technology
Modeling of Endurance Degradation of Anti-ferroelectric Hf1-xZrxO2 Capacitor
Yaru Ding
Zhejiang University
The Formation of Air-gaps Isolation Used in Metal/Dielectric Stacking
Weidu Qin
Beijing Superstring Academy of Memory Technology
SMT OPTIMIZATION OF PMOSFET BASED ON MULTI-DEPOSITION AND IN-SITU N2 PLASMA TREATMENT
Longyue Zheng
Zhejiang University
FEA of Thermo-mechanically Induced Crack in IMD
Colin Chan
X-FAB Sarawak Sdn. Bhd.
Backside Deposition of LTO/Poly-Si Sealing Layer by One-step PECVD and Post Annealing
Junxian Gao
Lam Research
Copper Diffusion Improvement by Optimizing TaN and Integration in Power Device
Xiangyu Zhou
Beijing NAURA Microelectronics Equipment Co., Ltd.
A machine learning study to obtain an optimal processing pulsed frequency on reactive pulsed DC sputtering of aluminum nitride films
Xue-Li Tseng
National Central University
Full Wafer Combinatorial Deposition with In-situ XPS/UPS Characterizations
Weimin Li
Shanghai Institute of IC Materials Co., Ltd.
Tungsten Surface Roughness Improvement by Single Deposition Process
Zhengning Gao
Lam Research
The Effects of Different Silicon Oxide Substrates on Amorphous Silicon Thin-Film
Zhengdao Liu
Beijing NAURA Microelectronics Equipment Co., Ltd.
Potential confusion in the analysis of the current-voltage characteristics of high-k dielectric on lightly doped p-type silicon MIS capacitors
Wai Shing Lau
Nanyang Technological University
The secret of the leakage current mechanism in some historical device-quality high-k metal-insulator-metal capacitors
Wai Shing Lau
Nanyang Technological University
-
Study of HDPCVD Charge Improvement for ILD Process
Jie Yang
Lam Research
SiGe Epitaxy Improved by Si Cap Technology
Tao Wang
Shanghai Huali Integrated Circuit Corporation
IMPROVED PERFORMANCE OF PMOS BY OPTIMIZING THE EPITAXIAL MORPHOLOGY
Tao Wang
Shanghai Huali Integrated Circuit Corporation
Exploring the Effect of Gate Oxide Process on Electrical Performance of CMOS Device
Yongkang Hu
University of Science and Technology of China
Improving Gate Oxide Uniformity Using Wet-Dry Oxidation
Lin Tang
Zhejiang University
NiSix Anneal on Producer Pyra
Heping Du
Applied Materials
W CVD Process Extendibility Development for Challenging Gap Fill
Shao Rui
Applied Materials
NBTI Improvement Through Gate Process Optimization
Ying Ma
Applied Material China
Excellent Performance of PC XT in Soft-Clean
Xingluan Long
Applied Materials
Amorphous Silicon Bump Defect Mechanism Analysis and Improvement Strategy
Shudi Min
Applied Materials
Approach of Customized Thickness Profile and Superior Uniformity on SACVD
Xiang Li
Applied Materials
HARP STI Wafer Sliding and Pre-heat Improvement by Recipe Optimization
Yiyu Zhang
Applied Materials
HARP STI Range Improvement for 28nm HKMG Double Patterning Process
Zhaojie Sun
Applied Materials
High Bow wafer Handling Approach on Producer PECVD
Bin Wang
Applied Materials
Low Dep Rate Oxide Process Development for Glue Layer
Congcong Zhao
Applied materials
Excellent Stability Control for High Throughput DARC Process
Chao Zheng
Applied Materials
N-Dosage Non-Uniformity Tuning in Nitride Incorporated Gate Oxide Process
Eira Yang
Applied Materials
High Productivity of Advanced Al PVD in Al Slab
Xiaogang Su
Applied Materials
Tool transfer compatibility improvement for different thin wafer type
Jiaxi Liu
Applied Materials
Sponsors:
