From "Iso-Dense" Biasing to "Inverse Lithography:" Milestones in Optical Proximity Correction Technology
Michael Rieger
Synopsys(retired)
Symposium III: Dry & Wet Etch and Cleaning
Symposium III: Dry & Wet Etch and Cleaning
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Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
Allen(Cheng Yao) Chang
JSR
The integration and process challenges and solutions for advanced technology nodes
David Xiao
Qianmo Microelectronics
Patterning challenges and perspectives solutions in advanced DRAM technology nodes
Hongbo Sun
Beijing Chaoxian Memory Research Institute
A Study of Minimum ISO-Dense Etching CD Bias Loading Performance on Advanced Logic Trench Process
Chia Lin Lu
Applied Materials
Vertical and Horizontal Profile Control in STI Etch
Fansheng Wang
Applied Materials China
Effects of ALE Capabilities and DC Pulsing in Microwave ECR Plasma on Etching Processes for Cutting-Edge Logic LSI
Masaru Izawa
Hitachi High-Tech Corporation
Ultra-High Steep Ion Beam Etching by Employing Highly Dynamic Holder
Jiasheng Sun
Suzhou Youlun Vacuum Equipment Technology Co., Ltd.
Pulsing Plasma Application for Advanced Dry Etch Process
Zhongwei Jiang
Beijing NAURA Technology Group Co., Ltd.
Process Window Optimization for Gate Etch Process of 2D NAND
Li Fei Sun
Lam Research
Latest new results and developments of TSV for advanced 3DIC applications
Chao Lv
Beijing NAURA Technology Group Co., Ltd.
SiC Trench Etch with Varying Aspect Ratio and Rounded Corner
Shijing Wang
Shanghai BangXin Semi Technology Co., Ltd.
Modeling the Charging Effect on the Twisting Defects during High Aspect Ratio Etching of Dielectrics
Yuxuan Zhai
Institute of Microelectronics, Chinese Academy of Sciences
DTI Depth Uniformity Tuning by Ra and Gas Distribution
Lei Sun
Applied Materials China
Cleaning and Assessing Particles from Polymer Materials used in Semiconductor Manufacturing Tool
Ling Wang
Ferrotec Technology Development (Shanghai) Co. Ltd
The influence of Mandrel materials on graphic transmission in patterning process
Jun Luo
Beijing NAURA Technology Group Co., Ltd.
Mechanism and Effect of 4-Level RF Pulsing on Etching Process in Advanced Node
Yang Ding
Through-pitch CD Control with TIN Metal Hardmask Etch Process in Logic BEOL Patterning
Litian Xu
Beijing NAURA Technology Group Co., Ltd.
An Overview of Advanced Ion Beam Technology and Applications
Yuxing Yang
Jiangsu Leuven Instruments Co., Ltd.
Study on Wet Alkaline Chemicals Etching of Hole Dummy Polysilicon in 3D Multi-Layer Structure
Jiao Jin
Beijing Superstring Academy of Memory Technology
Novel IPA filtration technology for Advanced Wet Clean
Yoshiaki Yamada
Hangzhou Cobetter Filtration Equipment Co.,Ltd
Investigating the Etch Performance of Zirconium-Based Photoresist for Direct Silicon Oxide Etching
Ahmad Hassan Siddique
Tsinghua University
SiO2 etch rate drift investigation and mitigation in an ICP Al etch chamber
Chenming Xu
Jiangsu Leuven Instruments Co., Ltd.
Numerical Modelling on FFU Arrangements Optimization within Cleanroom during Preventive Maintenance.
Chengxi Yao
Sungkyunkwan University
Etching Surface and Etching Critical Dimension Control for IGZO TFT Fabrication in 3D Memory Device
Zehua Hei
Beijing Superstring Academy of Memory Technology
Contact silicon etch challenge in IGBT manufacturing
Licheng Yang
Beijing NAURA Technology Group Co., Ltd.
SiC Etch with Inductively Coupled Plasma for Power Device Applications
Haiyang Lv
Advanced Micro-Fabrication Equipment Company Inc.
The PMOS Silicon Recess Process Control With Evolution of Trench Morphology
Fan Yu
Beijing NAURA Technology Group Co., Ltd.
Analysis of Crucial Factors Influencing on Selectivity of SiGe/Si Stack Etching
Anton Kobelev
Suzhou STR Software Technology Co., Ltd
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A Study of Wet Cleaning Methods for Tungsten High Aspect Ratio Dry Etch
Chaoyang Guan
Beijing Superstring Academy of Memory Technology
A Study of Wafer Arcing Issue in Dielectric Via Etching
Taojun Zhang
Jiangsu Leuven Instruments Co., Ltd.
Process Engineering for Depth and N/P Loading Control in Polysilicon Gate Etching
Chun Gao
Lam Research
Unexpected Enhancement of Aluminum Etching Rate by Increased Nitrogen Concentration in Semiconductor Manufacturing
Quanzhi Long
Zhejiang University
Pre-Epitaxy Backside Iron Contamination Leads to Cluster Cone Defect in Shallow Trench Isolation
Zhanduo Bai
Semiconductor manufacturing International (Beijing) Corporation
Improved Clean Approach of Post Dual-Damascene AIO Etch for Low-K Damage Reduction
Yuying Liu
Lam Research
Characterization Studies of the Sidewall Polymer after TIN Etching on Microchip Al Bondpads Using Capacitance Coupled Plasma (CCP) Etcher
Xin Su
Advanced Micro-Fabrication Equipment Company Inc.
The Etching of SiO2/Mo-MoN/SiO2/TiN Stacks in an Inductively Coupled Plasma System
Jiahui Sun
Beijing Superstring Academy of Memory Technology
Undercut Profile Control of STI ETCH
Jianhang Chen
Nexchip Semiconductor Corportion
Comparison of 40MHz and 60MHz HF Frequencies in Dual-Frequency CCP for Low-k AIO Process
Weiming Liu
Advanced Micro-Fabrication Equipment Inc.
A Dry Etch Defect Type Comb Particle Exploration and Solution
Yang Wei
Nexchip Semiconductor Corporation
Optimization of the Uniformity of the Contact Resistance (RC) of the Via By the Collocation of Gas Parameters In AIO Etching
Gui Cong
Nexchip Semiconductor Corporation
Study of the Influence of Surface Cleaning Process on SiGe Epitaxy Particle Defects
Xuan Liu
Semiconductor Manufacturing North China (Beijing) Co.,Ltd.
Fluorine Memory Effect Elimination in Cu BEoL Top Via Etching
Sichao Zeng
Applied Materials China
High-k Metal Gate Etch on Sym3Y HT Chamber
Jie Wang
Applied Materials China
Sym3™ Lid Temperature Control System for Uniformity Improvement
Tianyuan Liu
Applied Materials China
Profile Control of 28nm HKMG Poly Etch
Xipeng Tong
Applied Materials China
Process Challenges of High Transmission Photomask Tuning on TetraTM Mask Etch
Long Men
Applied Materials China
Taper Profile Control for MOSFET Gate Contact Etch on SuperE
Wang Miao
Applied Materials China
Profile Control of CIS BMG Tungsten Etching
Le Jiang
Applied Materials China
Deep Si Etch Process Optimization with AppliedPRO
Fan Zhou
Applied Materials China
Digital Tool AppliedPRO™ for Etch Process Development
Kai Hu
Applied Materials China
A Solution to HVCAP VIA Etch Polymer Residue
Qunfeng Wen
Applied Materials China
Profile Tuning on VTG Etch Development
Zhang Weiqiang
Applied Materials China
Edge Yield Improvement for DRAM Capacitor Middle MESH Layer Punch Process with Sym3Y
Chunlong Qiu
Applied Materials China
Hydrogen Bromide Usage in Polysilicon Etching Process
Songtao Lv
Applied Materials China
Roughness Improvement of DTI Process by Argon Introduction
Difan Li
Applied Materials China
CoSi2 Loss Study of Contact Etch on ProducerTM
Bao Jing
Applied Materials China
Digital Tool Applied Crossmatch™ for Chamber matching
Jianjun Liao
Applied Materials China
In-Situ Strip to Improve Defects for Al Etch
Kairong Cui
Applied Materials China
High Open Ratio Al Pad Etch Challenge and Solution
Fan Chen
Applied Materials China
SRAM VIA Chain Height Control in Dual Damascene Etch Process
Ping Zheng,
Applied Materials China
ISO Dense CD loading in STI Etch
Jimmy Fu
Applied Materials China
DTC Etch in Packaging Device
Lijun Shan
Applied Materials China
Profile Control in PDL Etch
Tongyao Zhao
Applied Materials China
MTBC Improvement for Producer™ GT Passivation Etch
Jing Cao
Applied Materials China
Dual Damascus Pattern Depth Loading Challenges and Solutions
Shuda Xu
Applied Materials China
Improvement of TiN Hardmask Profile by N2 Gas
Ziyue Xuan
Applied Materials China
Ultra-low Bias Power CIS Deep Trench Isolation Etching
Hanlin Cui
Applied Materials China
Optimize Deep Trench Isolation Si etching with SF6 O2 Containing Plasma
Longjie Yu
Applied Materials China
Approach to Successfully Address TiN HMO Top View Challenges
Caili Lang
Applied Materials China
O2 Plasma Descum etch Residue Removal
Jiajie Li
Applied Materials China
Etch Profile Tuning Study on Small-sized Poly Gate
Wenyi Tang
Applied Materials China
Profile Optimization In Poly Gate Etch
Lin Luo
Applied Materials China
Residue Reduction in TIN HM ETCH
Dongjiang Wang
Applied Materials China
Approaches to Remove Ti-residue in TiN Hardmask Open Process
Rishuai Zheng
Applied Materials China
Advanced RF Pulsing in DRAM Bitline Etch Profile Control
Zheng Ruan
Lam Research
Application of Pulsing Plasma on DRAM Buried Wordline Microloading Control
Kevin Yao
Lam Research
Mandrel Etch Tuning for Imbalance Improvement in Reverse SADP
Shipeng Gong
Lam Research
Etch Profile Control of Alternate Oxide Tungsten Stack
Rui Hu
Applied Materials China
Tungsten plug etchback process in IGBT manufacturing
Haoran Song
Beijing NAURA Technology Group Co., Ltd.
Poly-Si cut process for storage node contact manufacturing in DRAM memory
Mengjiao Zhu
Beijing NAURA Technology Group Co., Ltd.
"Investigation of silicon oxide thin film utilizing plasma enhanced atomic layer deposition in ICP etcher"
Li Zeng
Beijing NAURA Technology Group Co., Ltd.
The process of etching high aspect ratio SiB at high temperature
Xuehua Wang
Beijing NAURA Technology Group Co., Ltd.
Micro loading issue improvement in poly gate etch
Yiman Ma
Beijing NAURA Technology Group Co., Ltd.
LWR improvement in self-aligned patterning process involved in 193nm photoresist treatment
Guangzhao Yuan
Beijing NAURA Technology Group Co., Ltd.
the influence of strip step on punch process
Yu Hao
Beijing NAURA Technology Group Co., Ltd.
Depth uniformity of silicon and dielectric trenches etching for the burried wordline of novel memory
Teng Zhang
Beijing NAURA Technology Group Co., Ltd.
IGZO film etching technique using BCl3 plasma following diluted hydrofluorine solution
Run Zhang
Beijing NAURA Technology Group Co., Ltd.
Array center and corner loading improvement in r-SADP
Shun Yang
Beijing NAURA Technology Group Co., Ltd.
Si top corner damage-free etch process for shallow trench isolation of beyond the 22nm node
Yingjie Wang
Beijing NAURA Technology Group Co., Ltd.
Deep Silicon Etching Process for Optimizing Sidewall Morphology
Yiming Ma
Beijing NAURA Technology Group Co., Ltd.
Chamber Conditions Control with Waferless Auto Clean Strategy in BEOL Aluminum Metal Etching Process
Guohui Jia
Beijing NAURA Technology Group Co., Ltd.
Study of Poly-Si etch rate sensititivity with Pulsing Mode of RF Powers for Soft-landing Step in Gate Patterning Process
Chao Xu
Beijing NAURA Technology Group Co., Ltd.
Self-Limited Behavior Study on Dielectric Quasi-Atomic Layer Etching for Selectivity Achievement
Xiaoxia Meng
Advanced Micro-Fabrication Equipment Company Inc.
An Approach to Improve Distortion With High-Aspect-Ratio Cryogenic Etching Using Boron-Containing Gases
Yue Wei
Advanced Micro-Fabrication Equipment Company Inc.
A Wafer Temperature Control System for Advanced Technology Node Manufacturing
Xiao Wei
Advanced Micro-Fabrication Equipment Company Inc.
A Snapshot Review on Salicide Technology Evolution for CMosFabrication from the Perspective of Process Integration
Yunlong Jia
Beijing NAURA Technology Group Co., Ltd.
Time-Multiplexed Alternating Plasma Etching of Piezoelectric Materials
Yuanwei Lin
Beijing NAURA Technology Group Co., Ltd.