Diamond based heterjunction devices: the future of diamond electronics
Haitao Ye
University of Leicester, UK
Symposium IV: Thin Film, Plating and Process Integration
Symposium IV: Thin Film, Plating and Process Integration
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Progress and outlook in GaN devices and its system implementation
Qing Wang
Southen University of Science & Technology
Process solution for multiple Vt engineering beyond 3nm technology node
Xiaona Zhu
Fudan University
Innovative Pathways: Exploring New Frontiers with Established Chip Manufacturing Techniques
Yunlong Li
Zhejiang University
The Integration of Low-k Films into Mosfet Process
Miao Zhang
Naura
Enabling Material and Process Technology Capabilities for Emerging Memory Innovation in the AI Era
Jerry Chen
Zhejiang Jingsheng M&E Co., Ltd.
IGZO 2T0C 3D DRAM
Di Geng
Institute of Microelectronics, Chinese Academy of Sciences
Hydrogen-Free IBD IGZO Thin Films with Outstanding Thermal Stability and Improved Step Coverage
Zichao Li
Jiangsu Leuven Instruments Co. Ltd
Investigation of Performance Optimization in Bottom-Gate a-IGZO Thin-Film Transistors with Varying Thicknesses of PECVD-SiO2 Gate Dielectric
Longge Mao
INSTITUTE OF MICROELECTRONICS OF THE CHINESE ACADEMY OF SCIENCES
Selective Reflector Assisted Thermal Budget Decrease
Jichu Zhang
NAURA Technology Group Co., Ltd
Implant Applications and Products to Enable Advanced Power Device Scaling and Revolution
David (Wei) Zou
Applied Materials
Inline Non-contacting Measurement of Effective Work Function
Zheng Zou
GHS Semiconductor Co. Ltd.
Gapfill improvement with Helium/Argon sputter gas of HDP FSG in Power device
Zibo Xue
Lam Research
Plasma Induced Damage (PID) Improvement on HDP USG Process
Bruce Fan
Lam Research
Material and Process Advances in Extending BEOL Cu Metallization and Beyond
George Wu
GHS Semiconductor Co. Ltd.
Interconnect Technology Evolution to Enhance Device Performance
Hongxiu Peng
Anji Microelectronics
Applications of Untra-high Vacuum PVD through Leading-edge Pure Ion Coating(PIC) Technology
Xinfeng Zhang
Semiconshop
Basic Principle and Recent Tango of Reactive Sputter Process
Qintong Zhang
Beijing NAURA Technology Group Co., Ltd.
Evolution Mechanism of Copper Grains In Advanced Interconnect Processes
Yinuo Jin
ACM Research (Shanghai), Inc, Tsinghua University
A structural perspective of ALD precursors' physical and chemical properties
Xiabing Lou
Origin Deposition Materials Co., Ltd.
Effect of high temperature furnace anneal to element diffusion in SiO2-Si3N4 stacks
Huimin Ren
Beijing Superstring Academy of Memory Technology
Optimization of The Synthetic Process Of Bis(Diethylamino)Silane Based on Response Surface Methodology
Zhenjun Yuan
China Silicon Corporation Ltd,Tsinghua University
Process Modeling and Uniformity Optimization in Low-temperature Si/SiGe Epitaxy
Yanlin Mao
STR Software Technology Co. Ltd.,
Enhancing Process Stability of AlN Thin Films through Pre-Deposition in Chamber and Optical Emission Spectroscopy Assisted by Big Data Analysis
YU-SHIN CHEN
National Central University
The Application of an Almost Forgotten Theory to Explain the Leakage Current Mechanism in State-of-the-Art High-K DRAM MIM Capacitors
Wai Shing Lau
Nanyang Technological University (Retired)
A new theory of high-k electrode material versus low-k electrode material for high-k metal-insulator-metal capacitors
Wai Shing Lau
Nanyang Technological University (Retired)
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Effect of Sputtering Paraments on the Surface Morphology and Electrical Properties of Thin Film Resistors
Lei Zhang
Zhejiang University
Effect and Optimization of Ge Pre-Amorphous Implantation on Nickel Silicide
Weitong Zhang
Zhejiang University
Dry Etching of Reduced Thermal Budget Borophosphosilicate Glass (BPSG) using Furnace Anneal: the effect of phosphorus and boron concentration
Dingting Han
Beijing Superstring Academy of Memory Technology
Dielectric NDC Film Bonding Strength Improvement
Junli Li
Lam Research
Study of UV Cure Effect on PEALD SiNx WER in 3D Architecture
Tielu Liu
Beijing Superstring Academy of Memory Technology
Low wet etch rate and high conformality nitride film for 28nm CESL
Wei Xia
Applied Materials (China), Inc.
Preparation of Nanotwinned Copper and Its Application in Advanced Packaging
Xiaoru Liao
Shanghai Skychem Chemical
Wafer Edge Tiny Defects Improvement for PETEOS Process
Fangfang Zheng
Applied Materials
A Study of High Temperature Amorphous Carbon Uniformity Trend Up Mechanism and Improvement
Delu Yu
Applied Materials
SAUSG Film Crack Resistance Improvement and Mechanism
Weifang Jiang
Applied Materials
Density Functional Theory Study on Mechanism for Oxygen Diffusion in Silicon with Hydrogen
Zongyue Chai
Zhejiang University
Reduction of Wafer Backside Aluminum Contamination for HARP STI Process
Zhuo Xiong
Applied Materials
Study of Chamber Idle Effect for PETEOS Application and Process Optimization
Rongrong Tian
Applied Materials
Applied Materials® Endura™ System PWS Feature for High W2W Repeatability
Qijian Deng
Applied Materials
Optimizing Polysilicon Deposition to Reduce Bump Defects in CMOS Technology
Ruida Yao
Zhejiang University
The Optimization of the Gate Polysilicon Deposition Process for Power MOSFETs
Xuelu Jiao
Zhejiang University
Superior Performance of Aluminum Contact Planarization for Silicon Carbide Power Devices
Shuang Li
Applied Materials
Low Stress TiN in Versa TTN for Hardmask Application
Yu Lei
Applied Materials (China), Inc.China
AMAT XLR W Chamber Developed For BSI CIS Metal Grid Application
Chongchong Xia
Applied Materials
New process development for IMD HDP FSG gapfill enhancement
Peng Zhou
Applied Materials China
Applied Materials® CloverTM Chamber Development For SiCr TFR In Mix Signal IC
Ling Li
Applied Materials China
The Optimization of Metasurface lenses Fabrication based on Silicon Pillars within the fab's 12-inch production line
Huiyun Jiang
Zhejiang University
BPSG process optimization for robust contact loop integration
Xiong Wei
Applied Materials
A New Method to Improve BDII inline Performance
Zhen Duan
Applied Materials (China), Inc. China
Optimization of approach for APFx finger defect
Jingyi Yang
Applied Materials China
Simulation Optimization and Fabrication Verification Study of Ion Implantation in 12-inch CMOS Process
Tao Gong
Zhejiang University
Annealing conditions effect on different elements ion implantation
Jiaxi Liu
Applied Materials
Silicon-Rich ONO Thickness Prediction Based on Deep Learning
jinjiang luo
Zhejiang University
High Performance of Advanced Al PVD for Power Device Metallization
Xiaobo Li
Applied Materials
New Approach of Pre-Clean Process for CuBS Application
Dongdong Wei
Applied Materials China
HDPCVD Plasma-Induced Damage Mechanism and Solution
Chao Zheng
Applied Materials(China)Inc.
V-Shaped Dislocation Prevention by Selective SiGe Epitaxy Process Tuning
CunZhe He
Semiconductor Manufacturing North China
Thick PETEOS Film Process Optimizing for Particles Performance Improvement
Songyuan Tang
Appiled Materials(China), Inc.
High Stress Oxide with PE-Silane
Shuo Cao
Applied Materials
Impulse PVD Solutions for Dielectric Films Deposition
Zhen Chen
Applied Materials (China), Inc. China
A enhanced PVD TiN process introduction for better gap fill capability and barrier property
Rui Shao
Applied Materials
HDPCVD Metal Contamination Reduction Strategy for CIS Industry
Congcong Zhao
Applied Materials
Good DIT and Gate Leakage Tunability for Gate Loop Process at Integrated Centura® Radiance® and DPN3® Chamber
Eira Yang
Applied Materials
Magic Oxygen Control in Silicon Wafers through High Temperature Annealing
Lynn Ji
Applied Materials
RTO WtW Thickness Control and Shift Prevention against Implant Dopant Outgassing
Jiaping Shen
Applied Materials
Vulcan® Peak Temperature Matching of Spike Process by T-peak Offset
Heping Du
Applied Materials
High Aspect Ratio CIS DTI Oxide with Remote Plasma Oxidation
Jie Zuo
Applied Materials China
Oxidation Balanced Growth Improvement on Gate & STI liner With ISSG Process
Yongchun Xuan
Applied Materials
Applied Materials® High Deposit Rate Cu Chamber for IGBT front-side Metal
Jian Hua
Applied Materials
Enhancing Thermal Uniformity in Dynamic Surface Anneal Process using the New Tuning Function
Wenfan Yang
Applied Materials
How Plasma Flood Gun Affect Beamline Ion Implant Process
Shasha Wang
Applied Materials
A quick post-PM recovery procedure for high-pressure silicon epitaxial process on reduced pressure epitaxy chamber
Meng Li
Applied Materials (China)
SFQR Improvement in ATM EPI
Peng Qin
Applied Materials (China)
The Challenges And Solutions of Damascus Copper Process
Zhaoqin(Jimmy) Zeng
Huali Microelectronics
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